SNLS299I May   2008  – June 2020 DS90LV028AQ-Q1

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Performance Curves
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Power Decoupling Recommendations
        2. 9.2.1.2 Termination
        3. 9.2.1.3 Input Failsafe Biasing
        4. 9.2.1.4 Probing LVDS Transmission Lines
        5. 9.2.1.5 Cables and Connectors, General Comments
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Differential Traces
      2. 10.1.2 PC Board Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.