SNLS452B November   2014  – August 2019 DS90UB949-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC And AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Definition Multimedia Interface (HDMI)
        1. 7.3.1.1 HDMI Receive Controller
      2. 7.3.2  Transition Minimized Differential Signaling
      3. 7.3.3  Enhanced Display Data Channel
      4. 7.3.4  Extended Display Identification Data (EDID)
        1. 7.3.4.1 External Local EDID (EEPROM)
        2. 7.3.4.2 Internal EDID (SRAM)
        3. 7.3.4.3 External Remote EDID
        4. 7.3.4.4 Internal Pre-Programmed EDID
      5. 7.3.5  Consumer Electronics Control (CEC)
      6. 7.3.6  +5-V Power Signal
      7. 7.3.7  Hot Plug Detect (HPD)
      8. 7.3.8  High-Speed Forward Channel Data Transfer
      9. 7.3.9  Back Channel Data Transfer
      10. 7.3.10 FPD-Link III Port Register Access
      11. 7.3.11 Power Down (PDB)
      12. 7.3.12 Serial Link Fault Detect
      13. 7.3.13 Interrupt Pin (INTB)
      14. 7.3.14 Remote Interrupt Pin (REM_INTB)
      15. 7.3.15 General-Purpose I/O
        1. 7.3.15.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 7.3.15.2 Back Channel Configuration
        3. 7.3.15.3 GPIO_REG[8:5] Configuration
      16. 7.3.16 SPI Communication
        1. 7.3.16.1 SPI Mode Configuration
        2. 7.3.16.2 Forward Channel SPI Operation
        3. 7.3.16.3 Reverse Channel SPI Operation
      17. 7.3.17 Backward Compatibility
      18. 7.3.18 Audio Modes
        1. 7.3.18.1 HDMI Audio
        2. 7.3.18.2 DVI I2S Audio Interface
          1. 7.3.18.2.1 I2S Transport Modes
          2. 7.3.18.2.2 I2S Repeater
        3. 7.3.18.3 AUX Audio Channel
        4. 7.3.18.4 TDM Audio Interface
      19. 7.3.19 Built-In Self Test (BIST)
        1. 7.3.19.1 BIST Configuration And Status
        2. 7.3.19.2 Forward Channel and Back Channel Error Checking
      20. 7.3.20 Internal Pattern Generation
        1. 7.3.20.1 Pattern Options
        2. 7.3.20.2 Color Modes
        3. 7.3.20.3 Video Timing Modes
        4. 7.3.20.4 External Timing
        5. 7.3.20.5 Pattern Inversion
        6. 7.3.20.6 Auto Scrolling
        7. 7.3.20.7 Additional Features
      21. 7.3.21 Spread Spectrum Clock Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 7.4.2 FPD-Link III Modes of Operation
        1. 7.4.2.1 Single Link Operation
        2. 7.4.2.2 Dual Link Operation
        3. 7.4.2.3 Replicate Mode
        4. 7.4.2.4 Auto-Detection of FPD-Link III Modes
      3. 7.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
      2. 7.5.2 Multi-Master Arbitration Support
      3. 7.5.3 I2C Restrictions on Multi-Master Operation
      4. 7.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 7.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 7.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Speed Interconnect Guidelines
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Application Performance Plots
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.15.3 GPIO_REG[8:5] Configuration

GPIO_REG[8:5] are register-only GPIOs and may be programmed as outputs or read as inputs through local register bits only. Where applicable, these bits are shared with I2S pins and will override I2S input if enabled into GPIO_REG mode. See Table 3 for GPIO enable and configuration.

A local GPIO value may be configured and read either through local register access, or remote register access through the Bidirectional Control Channel. Configuration and state of these pins are not transported from serializer to deserializer as is the case for GPIO[3:0].

Table 3. GPIO_REG and GPIO Local Enable and Configuration

DESCRIPTION REGISTER CONFIGURATION FUNCTION
GPIO_REG8 0x11[7:4] = 0x01 Output, L
0x11[7:4] = 0x09 Output, H
0x11[7:4] = 0x03 Input, Read: 0x1D[0]
GPIO_REG7 0x11[3:0] = 0x1 Output, L
0x11[3:0] = 0x9 Output, H
0x11[3:0] = 0x3 Input, Read: 0x1C[7]
GPIO_REG6 0x10[7:4] = 0x1 Output, L
0x10[7:4] = 0x9 Output, H
0x10[7:4] = 0x3 Input, Read: 0x1C[6]
GPIO_REG5 0x10[3:0] = 0x1 Output, L
0x10[3:0] = 0x9 Output, H
0x10[3:0] = 0x3 Input, Read: 0x1C[5]
GPIO3 0x0F[3:0] = 0x1 Output, L
0x0F[3:0] = 0x9 Output, H
0x0F[3:0] = 0x3 Input, Read: 0x1C[3]
GPIO2 0x0E[7:4] = 0x1 Output, L
0x0E[7:4] = 0x9 Output, H
0x0E[7:4] = 0x3 Input, Read: 0x1C[2]
GPIO1 0x0E[3:0] = 0x1 Output, L
0x0E[3:0] = 0x9 Output, H
0x0E[3:0] = 0x3 Input, Read: 0x1C[1]
GPIO0 0x0D[3:0] = 0x1 Output, L
0x0D[3:0] = 0x9 Output, H
0x0D[3:0] = 0x3 Input, Read: 0x1C[0]