SLLSF21C September   2018  – September 2019 ISO1500

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Supply Current Characteristics: Side 1(ICC1)
    12. 6.12 Supply Current Characteristics: Side 2(ICC2)
    13. 6.13 Switching Characteristics: Driver
    14. 6.14 Switching Characteristics: Receiver
    15. 6.15 Insulation Characteristics Curves
    16. 6.16 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 8.3.2 Failsafe Receiver
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Glitch-Free Power Up and Power Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate and Bus Length
        2. 9.2.2.2 Stub Length
        3. 9.2.2.3 Bus Loading
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Meets or exceeds requirements of TIA/EIA-485-A
  • Half-duplex transceiver
  • Low-EMI 1-Mbps data rate
  • Bus I/O protection
    • ± 16 kV HBM ESD
  • 1.71-V to 5.5-V Logic-side supply (VCC1), 4.5-V to 5.5-V Bus-side supply (VCC2)
  • 1/8 Unit load: up to 256 nodes on bus
  • Failsafe receiver for bus open, short, and idle
  • 100-kV/µs (typical) High common-mode transient immunity
  • Extended temperature range from –40°C to +125°C
  • Glitch-free power-up and power-down for hot plug-in
  • Ultra-small SSOP (DBQ-16) package
  • Safety-related certifications:
    • 4242-VPK VIOTM and 566-VPK VIORM per DIN VDE V 0884-11:2017-01
    • 3000-VRMS Isolation for 1 minute per UL 1577
    • IEC 60950-1, IEC 62368-1 and IEC 61010-1 certifications
    • CQC, TUV, and CSA certifications
    • VDE, UL, CQC and TUV certifications complete; CSA approval pending