SLLSF21D September   2018  – February  2020 ISO1500

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Supply Current Characteristics: Side 1(ICC1)
    12. 6.12 Supply Current Characteristics: Side 2(ICC2)
    13. 6.13 Switching Characteristics: Driver
    14. 6.14 Switching Characteristics: Receiver
    15. 6.15 Insulation Characteristics Curves
    16. 6.16 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 8.3.2 Failsafe Receiver
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Glitch-Free Power Up and Power Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate and Bus Length
        2. 9.2.2.2 Stub Length
        3. 9.2.2.3 Bus Loading
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics: Driver

Typical specs are at VCC1=3.3V, VCC2=5V, TA=27℃ (Min/Max specs are over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOD| Driver differential-output voltage magnitude Open circuit voltage, unloaded bus,
4.5 V ≤ VCC2 ≤ 5.5 V
1.5 4.3 VCC2 V
RL = 60 Ω, –7 V ≤ VTEST ≤ 12 V,
4.5 V < VCC2 < 5.5 V (see Figure 19)
1.5 2.5 V
RL = 100 Ω (see Figure 20), RS-422 load 2 2.9 V
RL = 54 Ω (see Figure 20), RS-485 load,
4.5 V < VCC2 < 5.5 V
1.5 2.5 V
Δ|VOD| Change in differential output voltage between two states RL = 54 Ω or RL = 100 Ω, see Figure 20 –50 50 mV
VOC Common-mode output voltage RL = 54 Ω or RL = 100 Ω, see Figure 20 0.5 × VCC2 3 V
ΔVOC(SS) change in steady-state common-mode output voltage between two states RL = 54 Ω or RL = 100 Ω, see Figure 20 –50 50 mV
VOC(PP) Peak-to-peak common-mode output voltage RL = 54 Ω or RL = 100 Ω, see Figure 20 300 mV
IOS Short-circuit output current VD = VCC1 or VD = VGND1, VDE = VCC1,
–7 V ≤ VO ≤ 12 V, see Figure 28
–175 175 mA
Ii Input current VD and VDE = 0 V or VD and VDE = VCC1 –10 10 µA
CMTI Common-mode transient immunity VD= VCC1 or GND1, VCM = 1200V, See Figure 22 85 100 kV/µs