SLLS868T September   2007  – April 2017 ISO7240C , ISO7240CF , ISO7240M , ISO7241C , ISO7241M , ISO7242C , ISO7242M

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
    10. 7.10 Supply Current Characteristics: VCC1 and VCC2 at 5-V Operation
    11. 7.11 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    12. 7.12 Supply Current Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    13. 7.13 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    14. 7.14 Supply Current Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    15. 7.15 Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
    16. 7.16 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V Operation
    17. 7.17 Switching Characteristics: VCC1 and VCC2 at 5-V Operation
    18. 7.18 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    19. 7.19 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
    20. 7.20 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    21. 7.21 Insulation Characteristics Curves
    22. 7.22 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Isolated Data Acquisition System for Process Control
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Isolated SPI for an Analog Input Module with 16 Inputs
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Isolated RS-232 Interface
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

See (1)
MIN MAX UNIT
VCC Supply voltage(2), VCC1, VCC2 –0.5 6 V
VI Voltage at IN, OUT, EN, DISABLE, CTRL –0.5 VCC + 0.5(3) V
IO Output current –15 15 mA
TJ Maximum junction temperature 170 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine model (MM), per ANSI/ESDS5.2-1996 ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage(2), VCC1, VCC2 3.15 5.5 V
IOH High-level output current –4 mA
IOL Low-level output current 4 mA
tui Input pulse width ISO724xC 40 ns
ISO724xM 6.67 5
1/tui Signaling rate ISO724xC 0 30(1) 25 Mbps
ISO724xM 0 200(1) 150
VIH High-level input voltage (IN) ISO724xM 0.7 VCC VCC V
VIL Low-level input voltage (IN) 0 0.3 VCC V
VIH High-level input voltage (IN, DISABLE, CTRL, EN) ISO724xC 2 5.5 V
VIL Low-level input voltage (IN, DISABLE, CTRL, EN) 0 0.8 V
TJ Junction temperature 150 °C
H External magnetic field-strength immunity per IEC 61000-4-8 and IEC 61000-4-9 certification 1000 A/m
(1) Typical value at room temperature and well-regulated power supply.
(2) For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V.
For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V.

7.4 Thermal Information

THERMAL METRIC(1) ISO724xx UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance Low-K board 168 °C/W
High-K board 77.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 39.5 °C/W
RθJB Junction-to-board thermal resistance 41.9 °C/W
ψJT Junction-to-top characterization parameter 13.5 °C/W
ψJB Junction-to-board characterization parameter 41.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Power Ratings

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50% duty cycle square wave (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Maximum power dissipation 220 mW

7.6 Insulation Specifications

PARAMETER TEST CONDITIONS VALUE UNIT
GENERAL
CLR External clearance(1) Shortest terminal-to-terminal distance through air 8 mm
CPG External creepage(1) Shortest terminal-to-terminal distance across the package surface 8 mm
DTI Distance through the insulation Minimum internal gap (internal clearance) 0.008 mm
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 ≥ 400 V
Material group II
Overvoltage Category Rated mains voltage ≤ 150 VRMS I-IV
Rated mains voltage ≤ 300 VRMS I-III
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12(2)
VIORM Maximum repetitive peak isolation voltage AC voltage (bipolar) 560 VPK
VIOTM Maximum transient isolation voltage VTEST = VIOTM
t = 60 s (qualification), t = 1 s (100% production)		 4000 VPK
qpd Apparent charge(3) Method a: After I/O safety test subgroup 2/3.
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.2 × VIORM , tm = 10 s, 		≤5 pC
Method a: After environmental tests subgroup 1,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.3 × VIORM , tm = 10 s, 		≤5
Method b1: At routine test (100% production) and preconditioning (type test)
Vini = VIOTM, tini = 1 s;
Vpd(m) = 1.5 × VIORM , tm = 1 s, 		≤5
CIO Barrier capacitance, input to output(4) VI = 0.4 sin (4E6πt) 2 pF
RIO Isolation resistance, input to output(4) VIO = 500 V, TA = 25°C > 1012 Ω
VIO = 500 V, 100°C ≤ TA ≤ 125°C >1011
VIO = 500 V at TS = 150°C >109
Pollution degree 2
Climatic category 40/125/21
UL 1577
VISO Withstand isolation voltage VTEST = VISO = 2500 VRMS, t = 60 s (qualification); VTEST = 1.2 × VISO = 3000 VRMS, t = 1 s (100% production) 2500 VRMS
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
(2) This coupler is suitable for basic electrical insulation only within the maximum operating ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
(3) Apparent charge is electrical discharge caused by a partial discharge (pd).
(4) All pins on each side of the barrier tied together creating a two-terminal device

7.7 Safety-Related Certifications

VDE CSA UL
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010-1 (VDE 0411-1): 2011-07 Approved under CSA Component Acceptance Notice 5A and IEC 60950-1 Recognized under UL 1577 Component Recognition Program
Basic Insulation
Maximum Transient Isolation Voltage, 4000 VPK;
Maximum Repetitive Peak Isolation Voltage, 560 VPK		 4000 VPK maximum isolation rating;
Basic insulation per CSA 60950-1-07 and IEC 60950-1 (2nd Ed), 366 VRMS maximum working voltage, 		Single protection, 2500 VRMS
Certificate Number: 40016131 Master Contract Number: 220991 File Number: E181974

7.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RθJA = 168°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C, see Figure 2 156 mA
RθJA = 168°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C, see Figure 2 239
TS Safety temperature 150 °C
(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

7.9 Electrical Characteristics: VCC1 and VCC2 at 5-V Operation

For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOFF Sleep mode output current EN at 0 V, Single channel 0 μA
VOH High-level output voltage IOH = –4 mA, See Figure 11 VCCO – 0.8 V
IOH = –20 μA, See Figure 11 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA, See Figure 11 0.4 V
IOL = 20 μA, See Figure 11 0.1
VI(HYS) Input voltage hysteresis 150 mV
IIH High-level input current IN at VCCI 10 μA
IIL Low-level input current IN at 0 V –10
CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) 2 pF
CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 15 25 50 kV/μs

7.10 Supply Current Characteristics: VCC1 and VCC2 at 5-V Operation

For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7240C/M
ICC1 Supply current, side 1 Quiescent, All channels, no load, EN at 3 V, VI = VCC or 0 V 1 3 mA
25 Mbps, All channels, no load, EN at 3 V, 12.5-MHz input-clock signal 7 10.5
ICC2 Supply current, side 2 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 15 22 mA
25 Mbps, 12.5-MHz input-clock signal 17 25
ISO7241C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 6.5 11 mA
25 Mbps, 12.5-MHz input-clock signal 12 18
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 13 20 mA
25 Mbps, 12.5-MHz input-clock signal 18 28
ISO7242C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 10 16 mA
25 Mbps, 12.5-MHz input-clock signal 15 24
ICC2 Supply current, side 2 All channels, no load,
EN1 at 3 V, EN2 at 3 V 		Quiescent, VI = VCC or 0 V 10 16 mA
25 Mbps, 12.5-MHz input-clock signal 15 24

7.11 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation

For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOFF Sleep mode output current EN at 0 V, Single channel 0 μA
VOH High-level output voltage IOH = –4 mA, See Figure 11 3.3-V side VCCO – 0.4 V
5-V side VCCO – 0.8
IOH = –20 μA, See Figure 11 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA, See Figure 11 0.4 V
IOL = 20 μA, See Figure 11 0.1
VI(HYS) Input voltage hysteresis 150 mV
IIH High-level input current IN at VCCI 10 μA
IIL Low-level input current IN at 0 V –10
CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) 2 pF
CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 15 25 50 kV/μs

7.12 Supply Current Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation

For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7240C/M
ICC1 Supply current, side 1 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 1 3 mA
25 Mbps, 12.5-MHz input-clock signal 7 10.5
ICC2 Supply current, side 2 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 9.5 15 mA
25 Mbps, 12.5-MHz input-clock signal 10.5 17
ISO7241C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 6.5 11 mA
12.5-MHz input-clock signal 12 18
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 8 13 mA
25 Mbps, 12.5-MHz input-clock signal 11.5 18
ISO7242C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 10 16 mA
12.5-MHz input-clock signal 15 24
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 6 10 mA
25 Mbps, 12.5-MHz input-clock signal 9 14

7.13 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation

For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOFF Sleep mode output current EN at 0 V, Single channel 0 μA
VOH High-level output voltage IOH = –4 mA, See Figure 11 3.3-V side VCCO – 0.4 V
5-V side VCCO – 0.8
IOH = –20 μA, See Figure 11 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA, See Figure 11 0.4 V
IOL = 20 μA, See Figure 11 0.1
VI(HYS) Input voltage hysteresis 150 mV
IIH High-level input current IN at VCCI 10 μA
IIL Low-level input current IN at 0 V –10
CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) 2 pF
CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 15 25 50 kV/μs

7.14 Supply Current Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation

For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7240C/M
ICC1 Supply current, side 1 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 0.5 1 mA
25 Mbps, 12.5-MHz input-clock signal 3 5
ICC2 Supply current, side 2 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 15 22 mA
25 Mbps, 12.5-MHz input-clock signal 17 25
ISO7241C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 4 7 mA
25 Mbps, 12.5-MHz input-clock signal 6.5 11
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 13 20 mA
25 Mbps, 12.5-MHz input-clock signal 18 28
ISO7242C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 6 10 mA
25 Mbps, 12.5-MHz input-clock signal 9 14
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 10 16 mA
25 Mbps, 12.5-MHz input-clock signal 15 24

7.15 Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation

For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOFF Sleep mode output current EN at 0 V, single channel 0 μA
VOH High-level output voltage IOH = –4 mA, See Figure 11 VCCO – 0.4 V
IOH = –20 μA, See Figure 11 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA, See Figure 11 0.4 V
IOL = 20 μA, See Figure 11 0.1
VI(HYS) Input voltage hysteresis 150 mV
IIH High-level input current IN at VCCI 10 μA
IIL Low-level input current IN at 0 V –10
CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) 2 pF
CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 15 25 50 kV/μs

7.16 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V Operation

For the 3.3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. Over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7240C/M
ICC1 Supply current, side 1 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 0.5 1 mA
25 Mbps, 12.5-MHz input-clock signal 3 5
ICC2 Supply current, side 2 All channels, no load, EN at 3 V Quiescent, VI = VCC or 0 V 9.5 15 mA
25 Mbps, 12.5-MHz input-clock signal 10.5 17
ISO7241C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 4 7 mA
25 Mbps, 12.5-MHz input-clock signal 6.5 11
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 8 13 mA
25 Mbps, 12.5-MHz input-clock signal 11.5 18
ISO7242C/M
ICC1 Supply current, side 1 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 6 10 mA
25 Mbps, 12.5-MHz input-clock signal 9 14
ICC2 Supply current, side 2 All channels, no load, EN1 at 3 V, EN2 at 3 V Quiescent, VI = VCC or 0 V 6 10 mA
25 Mbps, 12.5-MHz input-clock signal 9 14

7.17 Switching Characteristics: VCC1 and VCC2 at 5-V Operation

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay ISO724xC See Figure 11 18 42 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 2.5
tPLH, tPHL Propagation delay ISO724xM 10 23 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 1 2
tsk(pp) Part-to-part skew (2) ISO724xC 8 ns
ISO724xM 0 3
tsk(o) Channel-to-channel output skew (3) ISO724xC 2 ns
ISO724xM 0 1
tr Output signal rise time See Figure 11 2 ns
tf Output signal fall time 2
tPHZ Propagation delay, high-level-to-high-impedance output See Figure 12 15 20 ns
tPZH Propagation delay, high-impedance-to-high-level output 15 20
tPLZ Propagation delay, low-level-to-high-impedance output 15 20
tPZL Propagation delay, high-impedance-to-low-level output 15 20
tfs Failsafe output delay time from input power loss See Figure 13 12 μs
twake Wake time from input disable See Figure 14 15 μs
tjit(pp) Peak-to-peak eye-pattern jitter ISO724xM 150 Mbps NRZ data input, Same polarity input on all channels, See Figure 16 1 ns
(1) Also referred to as pulse skew.
(2) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
(3) tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads.

7.18 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay ISO724xC See Figure 11 20 50 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 3
tPLH, tPHL Propagation delay ISO724xM 12 29 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 1 2
tsk(pp) Part-to-part skew (1) ISO724xC 10 ns
ISO724xM 0 5
tsk(o) Channel-to-channel output skew (3) ISO724xC 3 ns
ISO724xM 0 1
tr Output signal rise time See Figure 11 2 ns
tf Output signal fall time 2
tPHZ Propagation delay, high-level-to-high-impedance output See Figure 12 15 20 ns
tPZH Propagation delay, high-impedance-to-high-level output 15 20
tPLZ Propagation delay, low-level-to-high-impedance output 15 20
tPZL Propagation delay, high-impedance-to-low-level output 15 20
tfs Failsafe output delay time from input power loss See Figure 13 18 μs
twake Wake time from input disable See Figure 14 15 μs
tjit(pp) Peak-to-peak eye-pattern jitter ISO724xM 150 Mbps PRBS NRZ data input, Same polarity input on all channels, See Figure 16 1 ns
(1) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.

7.19 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay ISO724xC See Figure 11 22 51 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 3
tPLH, tPHL Propagation delay ISO724xM 12 30 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 1 2
tsk(pp) Part-to-part skew (2) ISO724xC 10 ns
ISO724xM 0 5
tsk(o) Channel-to-channel output skew (3) ISO724xC 2.5 ns
ISO724xM 0 1
tr Output signal rise time See Figure 11 2 ns
tf Output signal fall time 2
tPHZ Propagation delay, high-level-to-high-impedance output See Figure 12 15 20 ns
tPZH Propagation delay, high-impedance-to-high-level output 15 20
tPLZ Propagation delay, low-level-to-high-impedance output 15 20
tPZL Propagation delay, high-impedance-to-low-level output 15 20
tfs Failsafe output delay time from input power loss See Figure 13 12 μs
twake Wake time from input disable See Figure 14 15 μs
tjit(pp) Peak-to-peak eye-pattern jitter ISO724xM 150 Mbps NRZ data input, Same polarity input on all channels, See Figure 16 1 ns
(1) Also known as pulse skew
(2) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
(3) tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads.

7.20 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay ISO724xC See Figure 11 25 56 ns
PWD Pulse-width distortion |tPHL – tPLH|(1) 4
tPLH, tPHL Propagation delay ISO724xM 12 34 ns
PWD Pulse-width distortion |tPHL – tPLH|(1) 1 2
tsk(pp) Part-to-part skew (2) ISO724xC 10 ns
ISO724xM 0 5
tsk(o) Channel-to-channel output skew (3) ISO724xC 3.5 ns
ISO724xM 0 1
tr Output signal rise time See Figure 11 2 ns
tf Output signal fall time 2 ns
tPHZ Propagation delay, high-level-to-high-impedance output See Figure 12 15 20 ns
tPZH Propagation delay, high-impedance-to-high-level output 15 20
tPLZ Propagation delay, low-level-to-high-impedance output 15 20
tPZL Propagation delay, high-impedance-to-low-level output 15 20
tfs Failsafe output delay time from input power loss See Figure 13 18 μs
twake Wake time from input disable See Figure 14 15 μs
tjit(pp) Peak-to-peak eye-pattern jitter ISO724xM 150 Mbps PRBS NRZ data input, same polarity input on all channels, See Figure 16 1 ns
(1) Also referred to as pulse skew.
(2) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
(3) tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads.

7.21 Insulation Characteristics Curves

ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M bkdwn_tst_lls868.gif
Figure 1. Isolation Capacitor Lifetime Projection
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M cur_ta_SLLS868.gif
Figure 2. Thermal Derating Curve for Limiting Current per VDE

7.22 Typical Characteristics

ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M icc_sr_lls868.gif
TA = 25°C Load = 15 pF All Channels
Figure 3. ISO7240C/M RMS Supply Current vs
Signaling Rate
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M icc3_sr_lls868.gif
TA = 25°C Load = 15 pF All Channels
Figure 5. ISO7242C/M RMS Supply Current vs
Signaling Rate
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M vi_ta_lls868.gif
Air Flow at 7 cf/m Low_K Board
Figure 7. Input Voltage Threshold vs Free-Air Temperature
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M io_vo_lls868.gif
TA = 25°C Load = 15 pF
Figure 9. High-Level Output Current vs
High-Level Output Voltage
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M icc2_sr_lls868.gif
TA = 25°C Load = 15 pF All Channels
Figure 4. ISO7241C/M RMS Supply Current vs
Signaling Rate
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M pd_ta_lls868.gif
TA = 25°C Load = 15 pF All Channels
Figure 6. Propagation Delay vs Free-Air Temperature
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M vcc1_ta_lls868.gif
Figure 8. VCC Undervoltage Threshold vs
Free-Air Temperature
ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M io2_vo_lls868.gif
TA = 25°C Load = 15 pF
Figure 10. Low-Level Output Current vs
Low-Level Output Voltage