SLLSEM2F November   2014  – March 2016 ISO7821

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Dissipation Characteristics
    6. 6.6  Electrical Characteristics, 5 V
    7. 6.7  Electrical Characteristics, 3.3 V
    8. 6.8  Electrical Characteristics, 2.5 V
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.5 V
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Voltage Feature Description
        1. 8.3.1.1 Regulatory Information
        2. 8.3.1.2 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 9.2.3 Application Performance Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 PCB Material
    2. 11.2 Layout Guidelines
    3. 11.3 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Signaling Rate: Up to 100 Mbps
  • Wide Supply Range: 2.25 V to 5.5 V
  • 2.25 V to 5.5 V Level Translation
  • Wide Temperature Range: –55°C to 125°C
  • Low Power Consumption, Typical 1.8 mA per Channel at 1 Mbps
  • Low Propagation Delay: 11 ns Typical
    (5 V Supplies)
  • Industry leading CMTI(Min): ±100 kV/μs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: > 25 Years
  • SOIC-16 Wide Body (DW) and Extra-Wide Body (DWW) Package Options
  • Safety and Regulatory Approvals:
    • 8000 VPK Reinforced Isolation per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
    • 5.7 kVRMS Isolation for 1 minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
    • CQC Certification per GB4943.1-2011
    • TUV Certification per EN 61010-1 and EN 60950-1
    • All DW Package Certifications Complete; DWW Package Certifications Complete per UL, TUV and Planned for VDE, CSA, and CQC

Applications

  • Industrial Automation
  • Motor Control
  • Power Supplies
  • Solar Inverters
  • Medical Equipment
  • Hybrid Electric Vehicles

Description

The ISO7821 is a high-performance, dual-channel digital isolator with 8000 VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, CQC, and TUV. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/O’s. Each isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. ISO7821 has one forward and one reverse-direction channel. If the input power or signal is lost, default output is 'high' for the ISO7821 and 'low' for the ISO7821F device. Used in conjunction with isolated power supplies, this device prevents noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO7821 has been significantly enhanced to ease system-level ESD, EFT, Surge and Emissions compliance. ISO7821 is available in 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages. The DWW package option comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ISO7821,
ISO7821F
SOIC, DW (16) 10.30 mm x 7.50 mm
Extra wide SOIC, DWW (16) 10.30 mm × 14.0 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

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Simplified Schematic

ISO7821 ISO7821F Simplified_Schematic_sllsem2.gif
VCCI and GNDI are supply and ground connections respectively for the input channels.
VCCO and GNDO are supply and ground connections respectively for the output channels.

Revision History

Changes from E Revision (December 2015) to F Revision

  • Changed the Safety and Regulatory Approvals list of Features Go
  • Added Features "TUV Certification per EN 61010-1 and EN 60950-1" Go
  • Changed text in the first paragraph of the Description From: "certifications according to VDE, CSA, and CQC". To: "certifications according to VDE, CSA, CQC, and TUV." Go
  • Added Note 1 to Table 2 Go
  • Added TUV to the Regulatory Information section and Table 4. Deleted Note 1 in Table 4 Go
  • Changed Figure 15 Go

Changes from D Revision (July 2015) to E Revision

Changes from C Revision (May 2015) to D Revision

Changes from B Revision (April 2015) to C Revision

Changes from A Revision (December 2014) to B Revision

Changes from * Revision (November 2014) to A Revision

  • Changed From: A product preview that included only page 1 and the pinout section To: A complete data sheet Go
  • Added Note: "This coupler..." to the High Voltage Feature Description section Go