SWRS219B October 2018 – September 2019 IWR6843
ADVANCE INFORMATION for pre-production products; subject to change without notice.
Refer to the PDF data sheet for device specific package drawings
Figure 6-5 shows the block diagram for customer programmable processor subsystems in the IWR6843 device. At a high level there are two customer programmable subsystems, as shown separated by a dotted line in the diagram. Left hand side shows the DSP Subsystem which contains TI's high-performance C674x DSP, hardware accelerator, a high-bandwidth interconnect for high performance (128-bit, 200MHz), and associated peripherals – four DMAs for data transfer,
LVDS interface for Measurement data output, L3 Radar data cube memory, ADC buffers, CRC engine, and data handshake memory (additional memory provided on interconnect).
The right side of the diagram shows the Master subsystem. Master subsystem as name suggests is the master of the device and controls all the device peripherals and house-keeping activities of the device. Master subsystem contains Cortex-R4F (Master R4F) processor and associated peripherals and house-keeping components such as DMAs, CRC and Peripherals (I2C, UART, SPIs, CAN, PMIC clocking module, PWM, and others) connected to Master Interconnect through Peripheral Central Resource (PCR interconnect).
Details of the DSP CPU core can be found at http://www.ti.com/product/TMS320C6748.
HIL module is shown in both the subsystems and can be used to perform the radar operations feeding the captured data from outside into the device without involving the RF subsystem. HIL on master SS is for controlling the configuration and HIL on DSPSS for high speed ADC data input to the device. Both HIL modules uses the same IOs on the device, one additional IO (DMM_MUX_IN) allows selecting either of the two.