SNVSBF7 November   2019 LDC1001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Axial Distance Sensing Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Condition
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring RP With LDC1001
      3. 7.3.3 Measuring Inductance With LDC1001
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB Pin Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDY Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Maps
      1. 7.6.1 Register Description
        1. 7.6.1.1  Revision ID (Address = 0x00)
        2. 7.6.1.2  RP_MAX (Address = 0x01)
        3. 7.6.1.3  RP_MIN (Address = 0x02)
        4. 7.6.1.4  Watchdog Timer Frequency (Address = 0x03)
        5. 7.6.1.5  LDC Configuration (Address = 0x04)
        6. 7.6.1.6  Clock Configuration (Address = 0x05)
        7. 7.6.1.7  Comparator Threshold High LSB (Address = 0x06)
        8. 7.6.1.8  Comparator Threshold High MSB (Address = 0x07)
        9. 7.6.1.9  Comparator Threshold Low LSB (Address = 0x08)
        10. 7.6.1.10 Comparator Threshold Low MSB (Address = 0x09)
        11. 7.6.1.11 INTB Pin Configuration (Address = 0x0A)
        12. 7.6.1.12 Power Configuration (Address = 0x0B)
        13. 7.6.1.13 Status (Address = 0x20)
        14. 7.6.1.14 Proximity Data LSB (Address = 0x21)
        15. 7.6.1.15 Proximity Data MSB (Address = 0x22)
        16. 7.6.1.16 Frequency Counter LSB (Address = 0x23)
        17. 7.6.1.17 Frequency Counter Mid-Byte (Address = 0x24)
        18. 7.6.1.18 Frequency Counter MSB (Address = 0x25)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of RP_MIN and RP_MAX
        1. 8.1.1.1 RP_MAX
        2. 8.1.1.2 RP_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Pins)
    2. 8.2 Typical Application
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor With LDC1001
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting RP_MIN and RP_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Analog supply voltage (VDD – GND) 6 V
IO supply voltage (VIO – GND) 6 V
Voltage on any analog pin –0.3 VDD + 0.3 V
Voltage on any digital pin –0.3 VIO + 0.3 V
Input current on INA and INB 8 mA
Junction temperature, TJ(2) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB. The package thermal impedance is calculated in accordance with JESD 51-7.