SNVS129F May   2004  – June 2016 LM2675

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - 3.3 V
    6. 7.6  Electrical Characteristics - 5 V
    7. 7.7  Electrical Characteristics - 12 V
    8. 7.8  Electrical Characteristics - Adjustable
    9. 7.9  Electrical Characteristics - All Output Voltage Versions
    10. 7.10 Typical Characteristics
    11. 7.11 Typical Characteristics - Fixed Output Voltage Versions
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adjustable Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Fixed Output Voltage Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection (L1)
          2. 9.2.1.2.2 Output Capacitor Selection (COUT)
          3. 9.2.1.2.3 Catch Diode Selection (D1)
          4. 9.2.1.2.4 Input Capacitor (CIN)
          5. 9.2.1.2.5 Boost Capacitor (CB)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Adjustable Output Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor SeIection (COUT)
          4. 9.2.2.2.4 Catch Diode Selection (D1)
          5. 9.2.2.2.5 Input Capacitor (CIN)
          6. 9.2.2.2.6 Boost Capacitor (CB)
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 WSON Package Devices
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Efficiency up to 96%
  • Available in 8-Pin SOIC, PDIP, and 16-Pin WSON Package
  • Requires only 5 External Components
  • 3.3-V, 5-V, 12-V, and Adjustable Output Versions
  • Adjustable Version Output Voltage Range: 1.21 V to 37 V
  • ±1.5% Maximum Output Voltage Tolerance Over Line and Load Conditions
  • Ensured 1-A Output Load Current
  • Wide Input Voltage Range: 8 V to 40 V
  • 260-kHz Fixed Frequency Internal Oscillator
  • TTL Shutdown Capability, Low-Power Standby Mode
  • Thermal Shutdown and Current Limit Protection

2 Applications

  • Simple High Efficiency (>90%) Step-Down (Buck) Regulator
  • Efficient Preregulator for Linear Regulators
  • Positive-to-Negative Converter

3 Description

The LM2675 series of regulators are monolithic integrated DC-DC converter circuits built with a LMDMOS process. These regulators provide all the active functions for a step-down (buck) switching regulator, capable of driving a 1-A load current with excellent line and load regulation. These devices are available in fixed output voltages of 3.3 V, 5 V, 12 V, and an adjustable output version.

Requiring a minimum number of external components, these regulators are simple to use and include patented internal frequency compensation and a fixed frequency oscillator.

The LM2675 series operates at a switching frequency of 260 kHz, thus allowing smaller-sized filter components than what would be needed with lower frequency switching regulators. Because of its very high efficiency (>90%), the copper traces on the printed-circuit board are the only heat sinking needed.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
LM2675 SOIC (8) 5.00 mm × 6.20 mm
PDIP (8) 10.16 mm × 6.60 mm
WSON (16) 5.00 mm × 5.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application

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