SNVS549C June   2009  – February 2016 LM3554

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Start-Up
      2. 6.3.2  Overvoltage Protection
      3. 6.3.3  Current Limit
      4. 6.3.4  Flash Termination (Strobe-Initiated Flash)
      5. 6.3.5  Flash Termination (I2C-Initiated Flash)
      6. 6.3.6  Flash Timeout
      7. 6.3.7  Torch Mode
      8. 6.3.8  TX1/Torch
      9. 6.3.9  ENVM/TX2/GPIO2
        1. 6.3.9.1 ENVM/TX2/GPIO2/INT as an Interrupt Output
      10. 6.3.10 Indicator LED/Thermistor (LEDI/NTC)
        1. 6.3.10.1 LED Indicator Mode (LEDI)
        2. 6.3.10.2 Thermal Comparator Mode (NTC)
      11. 6.3.11 Alternative External Torch (AET Mode)
      12. 6.3.12 Input Voltage Monitor
      13. 6.3.13 LM3554 Timing Diagrams
      14. 6.3.14 Flags Register and Fault Indicators
      15. 6.3.15 Thermal Shutdown
      16. 6.3.16 LED Fault
      17. 6.3.17 Flash Timeout
      18. 6.3.18 LED Thermal Fault
      19. 6.3.19 Input Voltage Monitor Fault
      20. 6.3.20 TX1 And TX2 Interrupt Flags
      21. 6.3.21 Light Load Disable
    4. 6.4 Device Functional Modes
      1. 6.4.1 Flash Mode
      2. 6.4.2 Pass Mode
      3. 6.4.3 Voltage-Output Mode
    5. 6.5 Programming
      1. 6.5.1 I2C-Compatible Interface
        1. 6.5.1.1 Start and Stop Conditions
        2. 6.5.1.2 I2C-Compatible Chip Address
        3. 6.5.1.3 Transferring Data
    6. 6.6 Register Maps
      1. 6.6.1 Register Descriptions
        1. 6.6.1.1 Torch Brightness Register
        2. 6.6.1.2 Flash Brightness Register
        3. 6.6.1.3 Flash Duration Register
        4. 6.6.1.4 Flags Register
        5. 6.6.1.5 Configuration Register 1
        6. 6.6.1.6 Configuration Register 2
        7. 6.6.1.7 GPIO Register
        8. 6.6.1.8 VIN Monitor Register
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Capacitor Selection
        2. 7.2.2.2 Input Capacitor Selection
        3. 7.2.2.3 Inductor Selection
        4. 7.2.2.4 NTC Thermistor Selection
        5. 7.2.2.5 NTC Thermistor Placement
        6. 7.2.2.6 Maximum Load Current (Voltage Mode)
        7. 7.2.2.7 Maximum Output Power
          1. 7.2.2.7.1 Voltage-Output Mode
          2. 7.2.2.7.2 LED Boost Mode
          3. 7.2.2.7.3 LED Pass Mode
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Device Support

10.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

10.2 Documentation Support

10.2.1 Related Documentation

For additional information, see the following:

AN1112 DSBGA Wafer Level Chip Scale Package (SNVA009)

10.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.4 Trademarks

E2E is a trademark of Texas Instruments.

Excel is a registered trademark of Microsoft Corp..

All other trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.