SNVS961E APRIL   2013  – January 2016 LM5023

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Detailed Pin Description
        1. 7.3.1.1 QR Pin
        2. 7.3.1.2 VSD Pin
        3. 7.3.1.3 SS Pin
        4. 7.3.1.4 COMP Pin
        5. 7.3.1.5 CS Pin
        6. 7.3.1.6 GND Pin
        7. 7.3.1.7 OUT Pin
        8. 7.3.1.8 VCC Pin
      2. 7.3.2 Start-Up
      3. 7.3.3 Quasi-Resonant Operation
      4. 7.3.4 Quasi-Resonant Operating Frequency
      5. 7.3.5 PWM Comparator
      6. 7.3.6 Soft-Start
      7. 7.3.7 Gate Driver
        1. 7.3.7.1 Skip-Cycle Operation
      8. 7.3.8 Current Limit and Current Sense
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Line Current-Limit Feedforward
          1. 8.2.2.2.1 Overvoltage Protection
        3. 8.2.2.3 Valley Switching
        4. 8.2.2.4 Hiccup Mode
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
IQR Negative injection current when the QR pin is being driven below ground 4 mA
VSD Maximum voltage –0.3 45 V
IVSD VSD clamp continuous current 500 µA
VIN Voltage range SS, COMP, QR –0.3 7 V
CS –0.3 1.25 V
OUT Gate-drive voltage at DRV –0.3 Self-limiting V
IOUT Peak OUT current, source 0.3 A
IOUT Peak OUT current sink 0.7 A
VCC Bias supply voltage –0.3 16 V
TJ Operating junction temperature –40 125 ºC
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Bias supply voltage 8 14 V
IVSD VSD Current 2 100 µA
IQR QR pin current 1 4 mA
TJ Junction temperature –40 125 ºC

6.4 Thermal Information

THERMAL METRIC(1) LM5023 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 168.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.6 °C/W
RθJB Junction-to-board thermal resistance 88.8 °C/W
ψJT Junction-to-top characterization parameter 7.1 °C/W
ψJB Junction-to-board characterization parameter 87.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Minimum and maximum apply over the junction temperature range of –40 to +125°C. Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at +25°C, and are provided for reference purposes only. Unless otherwise specified, the following conditions apply:
VCC = 10 V, FSW = 100 kHz 50% duty cycle, no load on OUT.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BIAS SUPPLY INPUT
VCCON Controller enable threshold 12 12.8 13.5 V
VCCOFF Minimum operating voltage 7 7.5 8 V
VRST Internal logic reset (fault latch) VCC falling < VRST 4.5 5 5.5 V
ICCST ICC current while in standby mode COMP = 0.5 V, CS = 0 V, no switching 340 420 µA
ICCOP Operating supply current COMP = 2.25 V, OUT switching 800 µA
SHUTDOWN CONTROL (VSD PIN)
IVSD OFF Off state leakage current 0.1 µA
VVSD ON1 ON state pulldown voltage at 10 µA After VCCON (IVSD = 10 µA) 0.65 V
VVSD_ON2 ON state pulldown voltage at 100 µA After VCCON (IVSD = 100 µA) 0.84 V
SKIP CYCLE MODE COMPARATOR
VSKIP Skip cycle mode enable threshold COMP falling 70 120 170 mV
VSK-HYS Skip cycle mode hysteresis 12 mV
QR DETECT
VOVP Overvoltage comparator threshold 2.85 3 3.17 V
TOVP Sample delay for OVP 870 1050 1270 ns
VDEM VDEM demagnetization threshold 0.35 V
FMAX Maximum frequency 114 130 148 kHz
TRST TRESTART 9.4 12 15.7 µs
PWM COMPARATORS
TPPWM COMP to OUT propagation delay COMP set to 2 V, CS stepped 0 to 0.4 V, time to OUT transition low, CLOAD = 0 20 ns
DMIN Minimum duty cycle COMP = 0 V 0%
GCOMP COMP to PWM comparator gain 0.33
VCOMP-O COMP open circuit voltage ICOMP = 20 µA 4.3 4.9 5.8 V
VCOMP-H COMP at maximum VCS 2.25 V
ICOMP COMP short circuit current COMP = 0 V –132 µA
RCOMP R pullup 41 45 49 kΩ
CURRENT LIMIT
VCS Cycle-by-cycle sense voltage limit threshold 450 500 550 mV
TLEB Leading edge blanking time 130 ns
TPCS Current limit to OUT delay CS step from 0 to 0.6 V time to onset of OUT transition low, CLOAD = 0 22 ns
RLEB CS blanking sinking impedance 15 35 Ω
GCM Current mirror gain IQR = 2 mA 100 A/A
VFF Line-current feedforward IQR = 2 mA 140 mV
HICCUP MODE
TOL_10 Over load detection timer IVSD= 10 µA 12 ms
TOL_100 Over load detection timer IVSD= 100 µA 1.2 ms
OUTPUT GATE DRIVER
VOH OUT high saturated IOUT = 50 mA, VCC-OUT 0.3 1.1 V
VOL OUT low saturated IOUT = 100 mA 0.3 1 V
IPH Peak OUT source current OUT = VCC/2 0.3 A
IPL Peak OUT sink current OUT = VCC/2 0.7 A
tr Rise time CLOAD = 1 nF 25 ns
tf Fall time CLOAD = 1 nF 15 ns
SOFT-START
ISS Soft-start current 17 22 30 µA
THERMAL
TSD Thermal shutdown temperature 165 ºC

6.6 Typical Characteristics

LM5023 TC VCCON vs Temp.png
Figure 1. VCCON vs. Temperature
LM5023 TC VRST vs Temp.png
Figure 3. VRST vs. Temperature
LM5023 TC ICCOP vs Temp.png
Figure 5. ICCOP vs. Temperature
LM5023 TC CS Threshold vs. Temperature.png
Figure 7. CS Threshold vs. Temperature
LM5023 TC VCCOFF vs Temp.png
Figure 2. VCCOFF vs. Temperature
LM5023 TC ICCST vs Temp.png
Figure 4. ICCST vs. Temperature
LM5023 TC FMAX vs. Temperature.png
Figure 6. FMAX vs. Temperature