SNVS234C September   2004  – September 2016 LM5112 , LM5112-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inverting Mode
      2. 7.4.2 Non-Inverting Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Considerations
        1. 10.1.1.1 Drive Power Requirement Calculations In LM5112
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NGG|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

NGG Package
6-Pin WSON
Top View
DGN Package
8-Pin MSOP PowerPAD
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME WSON MSOP
Exposed Pad — — — Exposed pad, underside of package: Internally bonded to the die substrate. Connect to VEE ground pin for low thermal impedance.
IN 1 4 I Non-inverting input pin: TTL compatible thresholds. Pull up to VCC when not used.
INB 6 2 I Inverting input pin: TTL compatible thresholds. Connect to IN_REF when not used.
IN_REF 5 1 — Ground reference for control inputs: Connect to power ground (VEE) for standard positive only output voltage swing. Connect to system logic ground when VEE is connected to a negative gate drive supply.
N/C — 5, 8 — Not internally connected
OUT 4 7 O Gate drive output: Capable of sourcing 3 A and sinking 7 A. Voltage swing of this output is from VEE to VCC.
VCC 3 6 I Positive supply voltage input: Locally decouple to VEE. The decoupling capacitor must be placed close to the chip.
VEE 2 3 — Power ground for driver outputs: Connect to either power ground or a negative gate drive supply for positive or negative voltage swing.