SNIS152E May   2009  – July 2015 LM57

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics - Accuracy Characteristics - Trip Point Accuracy
    6. 7.6 Electrical Characteristics - Accuracy Characteristics - VTEMP Analog Temperature Sensor Output Accuracy
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LM57 VTEMP Temperature-to-Voltage Transfer Function
        1. 8.3.1.1 LM57 VTEMP Voltage-to-Temperature Equations
      2. 8.3.2 RSENSE
      3. 8.3.3 Resistor Selection
      4. 8.3.4 TOVER and TOVER Digital Outputs
        1. 8.3.4.1 TOVER and TOVER Noise Immunity
      5. 8.3.5 Trip Test Digital Input
      6. 8.3.6 VTEMP Analog Temperature Sensor Output
        1. 8.3.6.1 VTEMP Noise Considerations
        2. 8.3.6.2 VTEMP Capacitive Loads
        3. 8.3.6.3 VTEMP Voltage Shift
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 ADC Input Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selection of RSENSE Resistors
      3. 9.2.3 Application Curves
      4. 9.2.4 Grounding of the TRIP TEST Pin
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Temperature Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (February 2013) to E Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added TSSOP Package option throughout data sheetGo

Changes from C Revision (February 2010) to D Revision

  • Changed layout of National Data Sheet to TI formatGo