SNVSAC1 June   2015 LMR16006Y-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fixed Frequency PWM Control
      2. 8.3.2 Bootstrap Voltage (CB)
      3. 8.3.3 Output Voltage Setting
      4. 8.3.4 Enable SHDN and VIN Undervoltage Lockout
      5. 8.3.5 Current Limit
      6. 8.3.6 Overvoltage Transient Protection
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conduction Mode
      2. 8.4.2 ECO Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Schottky Diode Selection
        4. 9.2.2.4 Input Capacitor Selection
        5. 9.2.2.5 Bootstrap Capacitor Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 Additional Application Circuit
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings (1)

MIN MAX UNIT
Input voltages VIN to GND -0.3 65 V
SHDN to GND -0.3 65
FB to GND -0.3 7
CB to SW -0.3 7
Output voltages SW to GND -1 60
SW to GND less than 30 ns transients -2 60
TJ Operation junction temperature -40 150 °C
Storage temperature, Tstg -55 165 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Buck regulator VIN 4 40 V
CB 4 46
CB to SW -0.3 6
SW -1 40
FB 0 5.5
Control SHDN 0 40
Temperature Operating junction temperature range, TJ -40 125 °C

7.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC (1) LMR16006Y-Q1 UNIT
DDC (SOT)
(6 PINS)
RθJA Junction-to-ambient thermal resistance 102 °C/W
RθJCtop Junction-to-case (top) thermal resistance 36.9
RθJB Junction-to board characterization parameter 28.4
(1) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, numberof thermal vias, board size, ambient temperature, and air flow.

7.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ) range of -40°C to +125°C, unless otherwise stated. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified, the following conditions apply: VIN = SHDN = 12 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN (INPUT POWER SUPPLY)
VIN Operating input voltage 4 40 V
ISHDN Shutdown supply current VEN = 0 V 1 3 µA
IQ Operating quiescent current (non-switching) no load, VIN = 12 V 28 µA
UVLO Undervoltage lockout thresholds Rising threshold 4 V
Falling threshold 3
SHDN
VSHDN_Thre Rising SHDN Threshold Voltage 1.05 1.25 1.38 V
ISHDN Input current SHDN = 2.3 V -4.2 µA
SHDN = 0.9 V -1
ISHDN_HYS Hysteresis current -3 µA
HIGH-SIDE MOSFET
RDS_ON On-resistance VIN = 12 V, CB to SW = 5.8 V 900 mΩ
VOLTAGE REFERENCE (FB PIN)
VFB Feedback voltage 0.747 0.765 0.782 V
VOUT Output voltage Fixed 3.3 V output version 3.201 3.3 3.399 V
Fixed 5 V output version 4.85 5 5.15 V
CURRENT LIMIT
ILIMIT Peak current limit VIN = 12 V, TJ = 25°C 1200 1700 mA
THERMAL PERFORMANCE
TSHDN(1) Thermal shutdown threshold 170 ºC
THYS(1) Hysteresis 10 ºC
(1) Ensured by design.

7.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SW (SW PIN)
ƒSW Switching frequency 1785 2100 2415 kHz
TON_MIN(1) Minimum turn-on time ƒSW = 2.1 MHz 80 ns
DMAX Maximum duty cycle 97%
(1) Ensured by design.

7.7 Typical Characteristics

Unless otherwise specified the following conditions apply: VIN = 12 V, ƒSW = 2100 kHz, L1 = 6.8 µH, Cout = 10 µF, TA = 25°C.
LMR16006Y-Q1 D002_SNVSAC1.gif
VOUT = 12 V ƒSW = 2100 kHz
Figure 1. Efficiency vs. Load Current
LMR16006Y-Q1 D004_SNVSAC1.gif
VOUT = 5 V ƒSW = 2.1 MHz
Figure 3. Load Regulation
LMR16006Y-Q1 D006_SNVSAC1.gif
VOUT = 5 V
Figure 5. Dropout Curve
LMR16006Y-Q1 D003_SNVSAC1.gif
VOUT = 5 V ƒSW = 2100 kHz
Figure 2. Efficiency vs. Load Current
LMR16006Y-Q1 D005_SNVSAC1.gif
VOUT = 5 V
Figure 4. Shutdown Current and Quiescent Current
LMR16006Y-Q1 D007_SNVSAC1.gif
Figure 6. UVLO Threshold