SNOS990H April   2002  – June 2016 LMV341-N , LMV342-N , LMV344-N

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - 2.7 V (DC)
    6. 6.6 Electrical Characteristics - 2.7 V (AC)
    7. 6.7 Electrical Characteristics - 5 V (DC)
    8. 6.8 Electrical Characteristics - 5 V (AC)
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Class AB Turnaround Stage Amplifier
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Feature
      2. 7.4.2 Low Input Bias Current
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Sample and Hold Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed-circuit board need to be considered. A
6.8-µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin needs to be bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V− pins need to be bypassed.

It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive ground connection.

Surface-mount components in 0805 size or smaller are recommended in the LMV341-N application circuits. Designers can take advantage of the VSSOP miniature sizes to condense board layout to save space and reduce stray capacitance.

10.2 Layout Example

LMV341-N LMV342-N LMV344-N layout_sot23_SNOS990.gif Figure 48. PCB Layout Example