SNAS646F December   2015  – November 2017 LMX2592

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Functional Description
      1. 7.3.1  Input Signal
      2. 7.3.2  Input Signal Path
      3. 7.3.3  PLL Phase Detector and Charge Pump
      4. 7.3.4  N Divider and Fractional Circuitry
      5. 7.3.5  Voltage Controlled Oscillator
      6. 7.3.6  VCO Calibration
      7. 7.3.7  VCO Doubler
      8. 7.3.8  Channel Divider
      9. 7.3.9  Output Distribution
      10. 7.3.10 Output Buffer
      11. 7.3.11 Phase Adjust
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down
      2. 7.4.2 Lock Detect
      3. 7.4.3 Register Readback
    5. 7.5 Programming
      1. 7.5.1 Recommended Initial Power on Programming Sequence
      2. 7.5.2 Recommended Sequence for Changing Frequencies
    6. 7.6 Register Maps
      1. 7.6.1 LMX2592 Register Map - Default Values
        1. 7.6.1.1 Register Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Optimization of Spurs
        1. 8.1.1.1 Understanding Spurs by Offsets
        2. 8.1.1.2 Spur Mitigation Techniques
      2. 8.1.2 Configuring the Input Signal Path
        1. 8.1.2.1 Input Signal Noise Scaling
      3. 8.1.3 Input Pin Configuration
      4. 8.1.4 Using the OSCin Doubler
      5. 8.1.5 Using the Input Signal Path Components
        1. 8.1.5.1 Moving Phase Detector Frequency
        2. 8.1.5.2 Multiplying and Dividing by the Same Value
      6. 8.1.6 Designing for Output Power
      7. 8.1.7 Current Consumption Management
      8. 8.1.8 Decreasing Lock Time
      9. 8.1.9 Modeling and Understanding PLL FOM and Flicker Noise
    2. 8.2 Typical Application
      1. 8.2.1 Design for Low Jitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHA|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.