SNVS171J November   2001  – January 2017 LP2992

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sleep Mode
      2. 7.3.2 Low Ground Current
      3. 7.3.3 Low Noise
      4. 7.3.4 Enhanced Stability
      5. 7.3.5 Overcurrent Protection
      6. 7.3.6 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VOUT(TARGET) + 0.9 V ≥ VIN ≥ 16 V
      2. 7.4.2 Operation with ON/OFF Control
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Input Capacitor
          2. 8.2.2.1.2 Output Capacitor
          3. 8.2.2.1.3 Noise Bypass Capacitor
        2. 8.2.2.2 Capacitor Characteristics
          1. 8.2.2.2.1 Tantalum
        3. 8.2.2.3 Reverse Input-Output Voltage
        4. 8.2.2.4 Power Dissipation
        5. 8.2.2.5 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from I Revision (November 2015) to J Revision

  • Deleted specific values from capacitors in Simplified Schematic drawing Go
  • Added Receiving Notification of Documentation Updates Go

Changes from H Revision (January 2015) to I Revision

  • Added top navigator icon for TI Design Go
  • Changed "174.2°C/W" to "169.7°C/W" in footnote 3 to Abs Max table. Go
  • Changed ESD Ratings table to differentiate different values for different pins/packages. Go
  • Added new footnotes 2 and 3 to Thermal Information table; update thermal values for DBV (SOT-23) package.Go
  • Added Power Dissipation and Estimating Junction Temperature subsections Go
  • Added additional related document links Go

Changes from G Revision (March 2013) to H Revision

  • Added Device Information and ESD Ratings tables, Pin Configuration and Functions, Feature Description , Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sections; update Thermal Values and pin namesGo

Changes from F Revision (March 2013) to G Revision

  • Changed Changed layout of National Semiconductor data sheet to TI format Go