SNVS820B APRIL   2013  – December 2016 LP5562

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Logic Interface Characteristics
    7. 6.7  Recommended External Clock Source Conditions
    8. 6.8  I2C Timing Requirements (SDA, SCL)
    9. 6.9  Typical Characteristics: Current Consumption
    10. 6.10 Typical Characteristics: LED Output
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  LED Drivers Operational Description
        1. 7.3.1.1 LED Driver Current Control
        2. 7.3.1.2 Controlling LED Driver Output PWM
      2. 7.3.2  Direct I2C Register PWM Control Example
      3. 7.3.3  Program Execution Engines
        1. 7.3.3.1 Program Execution Engine States
        2. 7.3.3.2 Program Execution Engine Operation Modes
          1. 7.3.3.2.1 Operation Modes
        3. 7.3.3.3 Program Execution Engine Program Counter (PC)
        4. 7.3.3.4 Program Execution Engine Programming Commands
          1. 7.3.3.4.1 Ramp/Wait
          2. 7.3.3.4.2 Set PWM
          3. 7.3.3.4.3 Go-to-Start
          4. 7.3.3.4.4 Branch
          5. 7.3.3.4.5 End
          6. 7.3.3.4.6 Trigger
        5. 7.3.3.5 Program Load and Execution Example
      4. 7.3.4  Power-Save Mode
      5. 7.3.5  External Clock
      6. 7.3.6  Thermal Shutdown
      7. 7.3.7  Logic Interface Operational Description
      8. 7.3.8  I/O Levels
      9. 7.3.9  ADDR_SEL0, ADDR_SEL1 Pins
      10. 7.3.10 CLK_32 Pin
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 SRAM Memory
      2. 7.5.2 I2C-Compatible Serial Bus Interface
        1. 7.5.2.1 Interface Bus Overview
        2. 7.5.2.2 Data Transactions
        3. 7.5.2.3 Acknowledge Cycle
        4. 7.5.2.4 Acknowledge After Every Byte Rule
        5. 7.5.2.5 Addressing Transfer Formats
        6. 7.5.2.6 Control Register Write Cycle
        7. 7.5.2.7 Control Register Read Cycle
        8. 7.5.2.8 Register Read/Write Format
    6. 7.6 Register Maps
      1. 7.6.1  Enable Register (Enable) (Address = 00h) [reset = 00h]
      2. 7.6.2  Operation Mode Register (OP Mode) (address = 01h) [reset = 00h]
      3. 7.6.3  B LED Output PWM Control Register (B_PWM) (address = 02h) [reset = 00h]
      4. 7.6.4  G LED Output PWM Control Register (G_PWM) (address = 03h) [reset = 00h]
      5. 7.6.5  R LED Output PWM Control Register (R_PWM) (address = 04h) [reset = 00h]
      6. 7.6.6  B LED Output Current Control Register (B_CURRENT)(address = 05h) [reset = AFh]
      7. 7.6.7  G LED Output Current Control Register (G_CURRENT)(address = 06h) [reset = AFh]
      8. 7.6.8  R LED Output Current Control Register (R_CURRENT) (address = 07h) [reset = AFh]
      9. 7.6.9  Configuration Control Register (CONFIG) (address = 08h) [reset = 00h]
      10. 7.6.10 Engine 1 Program Counter Value Register (Engine 1 PC) (address = 09h) [reset = 00h]
      11. 7.6.11 Engine 2 Program Counter Value Register (Engine 2 PC) (address = 0Ah) [reset = 00h]
      12. 7.6.12 Engine 3 Program Counter Value Register (Engine 3 PC) (address = 0Ah) [reset = 00h]
      13. 7.6.13 STATUS/INTERRUPT Register (address = 0Ch) [reset = 00h]
      14. 7.6.14 RESET Register (address = 0Dh) [reset = 00h]
      15. 7.6.15 WLED Output PWM Control Register (W_PWM) (address = 0Eh) [reset = 00h]
      16. 7.6.16 W LED Output Current Control Register (W_CURRENT) (address = 0Fh) [reset = AFh]
      17. 7.6.17 LED Mapping Register (LED Map) (address = 70h) [reset = 39h]
      18. 7.6.18 Program Memory (address = 10h - 6Fh) [reset = 00h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Current Configuration
        2. 8.2.2.2 PWM Frequency Configuration
        3. 8.2.2.3 Clock Source Configuration
        4. 8.2.2.4 Power-Save Mode Configuration
        5. 8.2.2.5 Light Engine Configuration
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

Figure 46 is a layout recommendation for the LP5562 used to demonstrate the principles of good layout. This example is for a 2-layer PCB and a single LP5562 device. This layout can be adapted to the actual application layout if/where possible. If multiple LP5562 devices are used in the application then not all the ADDRSEL pins will be tied to ground. In that case a PCB using HDI process is needed to route ADDRSEL0 and GND bumps. The VDD decoupling cap must be placed close to VDD bump, and the traces for W, R, G, and B bumps must be sized to carry 25.5 mA.

10.2 Layout Example

LP5562 layout_snvs820.gif Figure 46. LP5562 Layout Example