SLAS897B September   2013  – September 2018 MSP430F5232 , MSP430F5234 , MSP430F5237 , MSP430F5239 , MSP430F5242 , MSP430F5244 , MSP430F5247 , MSP430F5249

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
      2. 4.2.1     RST/NMI and RSTDVCC/SBWTDIO Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3, RSTDVCC/SBWTDIO, RST/NMI)
    8. 5.8  Inputs – Interrupts (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    12. 5.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT2
    17. 5.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    18. 5.18 Internal Reference, Low-Frequency Oscillator (REFO)
    19. 5.19 DCO Frequency
    20. 5.20 PMM, Brownout Reset (BOR)
    21. 5.21 PMM, Core Voltage
    22. 5.22 PMM, SVS High Side
    23. 5.23 PMM, SVM High Side
    24. 5.24 PMM, SVS Low Side
    25. 5.25 PMM, SVM Low Side
    26. 5.26 Wake-up Times From Low-Power Modes and Reset
    27. 5.27 Timer_A
    28. 5.28 Timer_B
    29. 5.29 USCI (UART Mode) Clock Frequency
    30. 5.30 USCI (UART Mode)
    31. 5.31 USCI (SPI Master Mode) Clock Frequency
    32. 5.32 USCI (SPI Master Mode)
    33. 5.33 USCI (SPI Slave Mode)
    34. 5.34 USCI (I2C Mode)
    35. 5.35 10-Bit ADC, Power Supply and Input Range Conditions
    36. 5.36 10-Bit ADC, Timing Parameters
    37. 5.37 10-Bit ADC, Linearity Parameters
    38. 5.38 REF, External Reference
    39. 5.39 REF, Built-In Reference
    40. 5.40 Comparator_B
    41. 5.41 Flash Memory
    42. 5.42 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Port Mapping Controller (Link to User's Guide)
      3. 6.9.3  Oscillator and System Clock (Link to User's Guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to User's Guide)
      5. 6.9.5  Hardware Multiplier (MPY) (Link to User's Guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to User's Guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to User's Guide)
      8. 6.9.8  System (SYS) Module (Link to User's Guide)
      9. 6.9.9  DMA Controller (Link to User's Guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to User's Guide)
      12. 6.9.12 TA1 (Link to User's Guide)
      13. 6.9.13 TA2 (Link to User's Guide)
      14. 6.9.14 TB0 (Link to User's Guide)
      15. 6.9.15 Comparator_B (Link to User's Guide)
      16. 6.9.16 ADC10_A (Link to User's Guide)
      17. 6.9.17 CRC16 (Link to User's Guide)
      18. 6.9.18 Reference (REF) Module Voltage Reference (Link to User's Guide)
      19. 6.9.19 Embedded Emulation Module (EEM) (S Version) (Link to User's Guide)
      20. 6.9.20 Peripheral File Map
    10. 6.10 Input/Output Diagrams
      1. 6.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      8. 6.10.8  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      9. 6.10.9  Port P7 (P7.0 to P7.5) Input/Output With Schmitt Trigger
      10. 6.10.10 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      11. 6.10.11 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 Device Descriptors
  7. 7Device and Documentation Support
    1. 7.1  Getting Started and Next Steps
    2. 7.2  Device Nomenclature
    3. 7.3  Tools and Software
    4. 7.4  Documentation Support
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Wake-up Times From Low-Power Modes and Reset

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tWAKE-UP-FAST Wake-up time from LPM2, LPM3, or LPM4 to active mode(1) PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
fMCLK ≥ 4 MHz 3.5 7.5 µs
1 MHz < fMCLK < 4 MHz 4.5 9
tWAKE-UP-SLOW Wake-up time from LPM2, LPM3 or LPM4 to active mode(2)(3) PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 0
150 175 µs
tWAKE-UP-LPM5 Wake-up time from LPM4.5 to active mode(4) 2 3 ms
tWAKE-UP-RESET Wake-up time from RST or BOR event to active mode(4) 2 3 ms
This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the performance mode of the low-side supervisor (SVSL) and low-side monitor (SVML). tWAKE-UP-FAST is possible with SVSL and SVML in full performance mode or disabled. For specific register settings, see the Low-Side SVS and SVM Control and Performance Mode Selection section in the Power Management Module and Supply Voltage Supervisor chapter of the MSP430x5xx and MSP430x6xx Family User's Guide.
This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the performance mode of the low-side supervisor (SVSL) and low-side monitor (SVML). tWAKE-UP-SLOW is set with SVSL and SVML in normal mode (low current mode). For specific register settings, see the Low-Side SVS and SVM Control and Performance Mode Selection section in the Power Management Module and Supply Voltage Supervisor chapter of the MSP430x5xx and MSP430x6xx Family User's Guide.
The wake-up times from LPM0 and LPM1 to AM are not specified. They are proportional to MCLK cycle time but are not affected by the performance mode settings as for LPM2, LPM3, and LPM4.
This value represents the time from the wake-up event to the reset vector execution.