SLAS380D April   2004  – November 2014 MSP430FG437 , MSP430FG438 , MSP430FG439

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Supply Current Into AVCC + DVCC Excluding External Current
    5. 5.5  Schmitt-Trigger Inputs - Ports P1 to P6, RST/NMI, JTAG (TCK, TMS, TDI/TCLK, TDO/TDI)
    6. 5.6  Inputs Px.y, TAx, TBx
    7. 5.7  Leakage Current - Ports P1 to P6
    8. 5.8  Outputs - Ports P1 to P6
    9. 5.9  Output Frequency
    10. 5.10 Typical Characteristics - Outputs
    11. 5.11 Wake-Up From LPM3
    12. 5.12 RAM
    13. 5.13 LCD
    14. 5.14 Comparator_A
    15. 5.15 Comparator_A Typical Characteristics
    16. 5.16 Power-On Reset (POR) and Brownout Reset (BOR)
    17. 5.17 Supply Voltage Supervisor (SVS) and Supply Voltage Monitor (SVM)
    18. 5.18 DCO
    19. 5.19 Crystal Oscillator, XT1 Oscillator
    20. 5.20 Crystal Oscillator, XT2 Oscillator
    21. 5.21 USART0
    22. 5.22 12-Bit ADC, Power Supply and Input Range Conditions
    23. 5.23 12-Bit ADC, External Reference
    24. 5.24 12-Bit ADC, Built-In Reference
    25. 5.25 12-Bit ADC, Timing Parameters
    26. 5.26 12-Bit ADC, Linearity Parameters
    27. 5.27 12-Bit ADC, Temperature Sensor and Built-In VMID
    28. 5.28 12-Bit DAC, Supply Specifications
    29. 5.29 12-Bit DAC, Linearity Specifications
    30. 5.30 12-Bit DAC, Output Specifications
    31. 5.31 12-Bit DAC, Reference Input Specifications
    32. 5.32 12-Bit DAC, Dynamic Specifications
    33. 5.33 12-Bit DAC, Dynamic Specifications (Continued)
    34. 5.34 Operational Amplifier (OA), Supply Specifications
    35. 5.35 Operational Amplifier (OA), Input/Output Specifications
    36. 5.36 Operational Amplifier (OA), Dynamic Specifications
    37. 5.37 OA Dynamic Specifications Typical Characteristics
    38. 5.38 Flash Memory
    39. 5.39 JTAG Interface
    40. 5.40 JTAG Fuse
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Instruction Set
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Special Function Registers (SFRs)
      1. 6.5.1 Interrupt Enable Registers 1 and 2
      2. 6.5.2 Interrupt Flag Registers 1 and 2
      3. 6.5.3 Module Enable Registers 1 and 2
    6. 6.6  Memory Organization
    7. 6.7  Bootstrap Loader (BSL)
    8. 6.8  Flash Memory
    9. 6.9  Peripherals
      1. 6.9.1  DMA Controller
      2. 6.9.2  Oscillator and System Clock
      3. 6.9.3  Brownout, Supply Voltage Supervisor
      4. 6.9.4  Digital I/O
      5. 6.9.5  Basic Timer1
      6. 6.9.6  LCD Drive
      7. 6.9.7  OA
      8. 6.9.8  Watchdog Timer (WDT)
      9. 6.9.9  USART0
      10. 6.9.10 Timer_A3
      11. 6.9.11 Timer_B3
      12. 6.9.12 Comparator_A
      13. 6.9.13 ADC12
      14. 6.9.14 DAC12
      15. 6.9.15 Peripheral File Map
    10. 6.10 Input/Output Schematics
      1. 6.10.1  Port P1, P1.0 to P1.5, Input/Output With Schmitt Trigger
      2. 6.10.2  Port P1, P1.6 and P1.7, Input/Output With Schmitt Trigger
      3. 6.10.3  Port P2, P2.0 and P2.4 to P2.5, Input/Output With Schmitt Trigger
      4. 6.10.4  Port P2, P2.1 to P2.3, Input/Output With Schmitt Trigger
      5. 6.10.5  Port P2, P2.6 and P2.7, Input/Output With Schmitt Trigger
      6. 6.10.6  Port P3, P3.0 to P3.3, Input/Output With Schmitt Trigger
      7. 6.10.7  Port P3, P3.4 to P3.7, Input/Output With Schmitt Trigger
      8. 6.10.8  Port P4, P4.0 to P4.5, Input/Output With Schmitt Trigger
      9. 6.10.9  Port P4, P4.6, Input/Output With Schmitt Trigger
      10. 6.10.10 Port P4, P4.7, Input/Output With Schmitt Trigger
      11. 6.10.11 Port P5, P5.0, Input/Output With Schmitt Trigger
      12. 6.10.12 Port P5, P5.1, Input/Output With Schmitt Trigger
      13. 6.10.13 Port P5, P5.2 to P5.4, Input/Output With Schmitt Trigger
      14. 6.10.14 Port P5, P5.5 to P5.7, Input/Output With Schmitt Trigger
      15. 6.10.15 Port P6, P6.0, P6.2, and P6.4, Input/Output With Schmitt Trigger
      16. 6.10.16 Port P6, P6.1, Input/Output With Schmitt Trigger
      17. 6.10.17 Port P6, P6.3, Input/Output With Schmitt Trigger
      18. 6.10.18 Port P6, P6.5, Input/Output With Schmitt Trigger
      19. 6.10.19 Port P6, P6.6, Input/Output With Schmitt Trigger
      20. 6.10.20 Port P6, P6.7, Input/Output With Schmitt Trigger
      21. 6.10.21 VeREF+/DAC0
      22. 6.10.22 JTAG Pins TMS, TCK, TDI/TCLK, TDO/TDI, Input/Output With Schmitt Trigger or Output
      23. 6.10.23 JTAG Fuse Check Mode
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Development Kit
      2. 7.1.2 Device and Development Tool Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Links
      2. 7.2.2 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the MSP430FG43x device applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools.

For a complete listing of development-support tools for the MSP430FG43x platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

7.1.1.1 Development Kit

The MSP-FET430U80 is a powerful flash emulation tool that includes the hardware and software required to quickly begin application development on the MSP430 MCU. It includes a ZIF socket target board and a USB debugging interface (MSP-FET) used to program and debug the MSP430 in-system through the JTAG interface or the pin saving Spy Bi-Wire (2-wire JTAG) protocol. The flash memory can be erased and programmed in seconds with only a few keystrokes, and because the MSP430 flash is ultra-low power, no external power supply is required.

The debugging tool interfaces the MSP430 to the included integrated software environment and includes code to start your design immediately.

7.1.2 Device and Development Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of three prefixes: MSP, PMS, or XMS (for example, MSP430F5259). Texas Instruments recommends two of three possible prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully qualified production devices and tools (with MSP for devices and MSP for tools).

Device development evolutionary flow:

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

PMS – Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification

MSP – Fully qualified production device

Support tool development evolutionary flow:

MSPX – Development-support product that has not yet completed Texas Instruments internal qualification testing.

MSP – Fully-qualified development-support product

XMS and PMS devices and MSPX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices and MSP development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend for reading the complete device name for any family member.

Part_Number_Decoder_MSP430.gifFigure 7-1 Device Nomenclature

7.2 Documentation Support

The following documents describe the MSP430FG43x microcontrollers. Copies of these documents are available on the Internet at www.ti.com.

    SLAU056MSP430x4xx Family User's Guide. Detailed description of all modules and peripherals available in this device family.
    SLAZ365MSP430FG439 Device Erratasheet. Describes the known exceptions to the functional specifications for all silicon revisions of this device.
    SLAZ364MSP430FG438 Device Erratasheet. Describes the known exceptions to the functional specifications for all silicon revisions of this device.
    SLAZ363MSP430FG437 Device Erratasheet. Describes the known exceptions to the functional specifications for all silicon revisions of this device.

7.2.1 Related Links

Table 7-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7-1 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
MSP430FG439 Click here Click here Click here Click here Click here
MSP430FG438 Click here Click here Click here Click here Click here
MSP430FG437 Click here Click here Click here Click here Click here

7.2.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.3 Trademarks

MSP430, E2E are trademarks of Texas Instruments.

7.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.