SLASEC4D May   2018  – December 2019 MSP430FR2153 , MSP430FR2155 , MSP430FR2353 , MSP430FR2355

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
      1.      Revision History
  2. 2Device Comparison
    1. 2.1 Related Products
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagrams
    2. 3.2 Pin Attributes
    3. 3.3 Signal Descriptions
    4. 3.4 Pin Multiplexing
    5. 3.5 Buffer Type
    6. 3.6 Connection of Unused Pins
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 4.5  Active Mode Supply Current Per MHz
    6. 4.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 4.7  Low-Power Mode LPM3 and LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 4.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 4.9  Production Distribution of LPM Supply Currents
    10. 4.10 Typical Characteristics - Current Consumption Per Module
    11. 4.11 Thermal Resistance Characteristics
    12. 4.12 Timing and Switching Characteristics
      1. 4.12.1  Power Supply Sequencing
        1. Table 4-1 PMM, SVS and BOR
      2. 4.12.2  Reset Timing
        1. Table 4-2 Wake-up Times From Low-Power Modes and Reset
      3. 4.12.3  Clock Specifications
        1. Table 4-3 XT1 Crystal Oscillator (Low Frequency)
        2. Table 4-4 XT1 Crystal Oscillator (High Frequency)
        3. Table 4-5 DCO FLL, Frequency
        4. Table 4-6 DCO Frequency
        5. Table 4-7 REFO
        6. Table 4-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        7. Table 4-9 Module Oscillator (MODOSC)
      4. 4.12.4  Internal Shared Reference
        1. Table 4-10 Internal Shared Reference
      5. 4.12.5  General-Purpose I/Os
        1. Table 4-11 Digital Inputs
        2. Table 4-12 Digital Outputs
      6. 4.12.6  Digital I/O Typical Characteristics
      7. 4.12.7  Timer_B
        1. Table 4-13 Timer_B
      8. 4.12.8  eUSCI
        1. Table 4-14 eUSCI (UART Mode) Clock Frequencies
        2. Table 4-15 eUSCI (UART Mode) Switching Characteristics
        3. Table 4-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 4-17 eUSCI (SPI Master Mode) Switching Characteristics
        5. Table 4-18 eUSCI (SPI Slave Mode) Switching Characteristics
        6. Table 4-19 eUSCI (I2C Mode) Switching Characteristics
      9. 4.12.9  ADC
        1. Table 4-20 ADC, Power Supply and Input Range Conditions
        2. Table 4-21 ADC, Timing Parameters
        3. Table 4-22 ADC, Linearity Parameters
      10. 4.12.10 Enhanced Comparator (eCOMP)
        1. Table 4-23 eCOMP0
        2. Table 4-24 eCOMP1
      11. 4.12.11 Smart Analog Combo (SAC) (MSP430FR235x Devices Only)
        1. Table 4-25 SAC, OA
        2. Table 4-26 SAC, DAC
      12. 4.12.12 FRAM
        1. Table 4-27 FRAM
      13. 4.12.13 Emulation and Debug
        1. Table 4-28 JTAG, Spy-Bi-Wire Interface
        2. Table 4-29 JTAG, 4-Wire Interface
  5. 5Detailed Description
    1. 5.1  CPU
    2. 5.2  Operating Modes
    3. 5.3  Interrupt Vector Addresses
    4. 5.4  Memory Organization
    5. 5.5  Bootloader (BSL)
    6. 5.6  JTAG Standard Interface
    7. 5.7  Spy-Bi-Wire Interface (SBW)
    8. 5.8  FRAM
    9. 5.9  Memory Protection
    10. 5.10 Peripherals
      1. 5.10.1  Power Management Module (PMM) and On-Chip Reference Voltages
      2. 5.10.2  Clock System (CS) and Clock Distribution
      3. 5.10.3  General-Purpose Input/Output Port (I/O)
      4. 5.10.4  Watchdog Timer (WDT)
      5. 5.10.5  System Module (SYS)
      6. 5.10.6  Cyclic Redundancy Check (CRC)
      7. 5.10.7  Interrupt Compare Controller (ICC)
      8. 5.10.8  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_A1, eUSCI_B0, eUSCI_B1)
      9. 5.10.9  Timers (Timer0_B3, Timer1_B3, Timer2_B3, Timer3_B7)
      10. 5.10.10 Backup Memory (BKMEM)
      11. 5.10.11 Real-Time Clock (RTC) Counter
      12. 5.10.12 12-Bit Analog-to-Digital Converter (ADC)
      13. 5.10.13 Enhanced Comparator
      14. 5.10.14 Manchester Function Module (MFM)
      15. 5.10.15 Smart Analog Combo (SAC) (MSP430FR235x Devices Only)
      16. 5.10.16 eCOMP0, eCOMP1, SAC0, SAC1, SAC2, and SAC3 Interconnection (MSP430FR235x Devices Only)
      17. 5.10.17 Cross-Chip Interconnection (SACx are MSP430FR235x Devices Only)
      18. 5.10.18 Embedded Emulation Module (EEM)
      19. 5.10.19 Peripheral File Map
    11. 5.11 Input/Output Diagrams
      1. 5.11.1 Port P1 Input/Output With Schmitt Trigger
      2. 5.11.2 Port P2 Input/Output With Schmitt Trigger
      3. 5.11.3 Port P3 Input/Output With Schmitt Trigger
      4. 5.11.4 Port P4 Input/Output With Schmitt Trigger
      5. 5.11.5 Port P5 Input/Output With Schmitt Trigger
      6. 5.11.6 Port P6 Input/Output With Schmitt Trigger
    12. 5.12 Device Descriptors (TLV)
    13. 5.13 Identification
      1. 5.13.1 Revision Identification
      2. 5.13.2 Device Identification
      3. 5.13.3 JTAG Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Device Connection and Layout Fundamentals
      1. 6.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 6.1.2 External Oscillator
      3. 6.1.3 JTAG
      4. 6.1.4 Reset
      5. 6.1.5 Unused Pins
      6. 6.1.6 General Layout Recommendations
      7. 6.1.7 Do's and Don'ts
    2. 6.2 Peripheral- and Interface-Specific Design Information
      1. 6.2.1 ADC Peripheral
        1. 6.2.1.1 Partial Schematic
        2. 6.2.1.2 Design Requirements
        3. 6.2.1.3 Layout Guidelines
    3. 6.3 ROM Libraries
    4. 6.4 Typical Applications
  7. 7Device and Documentation Support
    1. 7.1 Getting Started
    2. 7.2 Device Nomenclature
    3. 7.3 Tools and Software
    4. 7.4 Documentation Support
    5. 7.5 Related Links
    6. 7.6 Trademarks
    7. 7.7 Electrostatic Discharge Caution
    8. 7.8 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Smart Analog Combo (SAC) (MSP430FR235x Devices Only)

The MSP430FR235x devices integrate four SAC modules: SAC0, SAC1, SAC2, and SAC3. The SAC integrates a high-performance low-power operational amplifier. SAC-L3 supports a hybrid configuration of general-purpose amplifier, 12-bit voltage reference DAC, and a multiplex switch array. For more information, see the SAC chapter in the MSP430FR4xx and MSP430FR2xx Family User's Guide. Only MSP430FR235x devices implement the SAC modules. MSP430FR215x devices do not support SAC modules.

The SAC0 and SAC2 are interconnected and support external inputs and internal inputs (see Table 5-27 and Table 5-28).

Table 5-27 SAC0 Channel Connections

PSEL SAC0 OA NONINVERTING CHANNELS NSEL SAC0 OA INVERTING CHANNELS
00 P1.3/OA0+/A3 00 P1.2/OA0-/A2
01 SAC0 12-bit DAC 01 PGA feedback
10 P3.1/OA2O, SAC2 OA output 10 P3.1/OA2O, SAC2 OA output
11 N/A 11 N/A

Table 5-28 SAC2 Channel Connections

PSEL SAC2 OA NONINVERTING CHANNELS NSEL SAC2 OA INVERTING CHANNELS
00 P3.3/OA2+ 00 P3.2/OA2-
01 SAC2 12-bit DAC 01 PGA feedback
10 P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1, SAC0 OA output 10 P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1, SAC0 OA output
11 N/A 11 N/A

The SAC1 and SAC3 are interconnected and support external inputs and internal inputs (see Table 5-29 and Table 5-30).

Table 5-29 SAC1 Channel Connections

PSEL SAC1 OA NONINVERTING CHANNELS NSEL SAC1 OA INVERTING CHANNELS
00 P1.7/OA1+/A7 00 P1.6/OA1-/A6
01 SAC1 12-bit DAC 01 PGA feedback
10 P3.5/OA3O, SAC3 OA output 10 P3.5/OA3O, SAC3 OA output
11 N/A 11 N/A

Table 5-30 SAC3 Channel Connections

PSEL SAC3 OA NONINVERTING CHANNELS NSEL SAC3 OA INVERTING CHANNELS
00 P3.7/OA3+ 00 P3.6/OA3-
01 SAC3 12-bit DAC 01 PGA feedback
10 P1.5/OA1O/A5, SAC1 OA output 10 P1.5/OA1O/A5, SAC1 OA output
11 N/A 11 N/A

Each SAC DAC supports two selectable voltage references (see Table 5-31).

Table 5-31 SACx DAC Reference Selection

DACSREF SACx DAC REFERENCE SELECTION
0 DVCC
1 Internal shared reference (1.5, 2.0, or 2.5 V )
DACSREF SAC1 DAC REFERENCE
0 DVCC
1 Internal shared reference (1.5, 2.0, or 2.5 V )
DACSREF SAC2 DAC REFERENCE
0 DVCC
1 Internal shared reference (1.5, 2.0, or 2.5 V )
DACSREF SAC3 DAC REFERENCE
0 DVCC
1 Internal shared reference (1.5, 2.0, or 2.5 V )

Each SAC DAC supports one software trigger and two hardware trigger from chip signals.

Table 5-32 SACx DAC Hardware Trigger Selection

DACLSEL SAC0 DAC HARDWARE TRIGGER DACLSEL SAC1 DAC HARDWARE TRIGGER
00 Writing SAC0DACDAT register 00 Writing SAC1DACDAT register
01 N/A 01 N/A
10 TB2.1 10 TB2.1
11 TB2.2 11 TB2.2
DACLSEL SAC2 DAC HARDWARE TRIGGER DACLSEL SAC3 DAC HARDWARE TRIGGER
00 Writing SAC2DACDAT register 00 Writing SAC3DACDAT register
01 N/A 01 N/A
10 TB2.1 10 TB2.1
11 TB2.2 11 TB2.2