SLASE32C August   2014  – August 2018 MSP430FR5887 , MSP430FR5888 , MSP430FR5889 , MSP430FR58891 , MSP430FR6887 , MSP430FR6888 , MSP430FR6889 , MSP430FR68891

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions – MSP430FR688x and MSP430FR688x1
      2. Table 4-2 Signal Descriptions – MSP430FR588x and MSP430FR588x1
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    10. 5.10 Typical Characteristics, Low-Power Mode Supply Currents
    11. 5.11 Typical Characteristics, Current Consumption per Module
    12. 5.12 Thermal Resistance Characteristics
    13. 5.13 Timing and Switching Characteristics
      1. 5.13.1 Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.13.2 Reset Timing
        1. Table 5-3 Reset Input
      3. 5.13.3 Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.13.4 Wake-up Characteristics
        1. Table 5-9   Wake-up Times From Low-Power Modes and Reset
        2. Table 5-10 Typical Wake-up Charge
        3. 5.13.4.1    Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 5.13.5 Peripherals
        1. 5.13.5.1 Digital I/Os
          1. Table 5-11 Digital Inputs
          2. Table 5-12 Digital Outputs
          3. 5.13.5.1.1  Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
          4. Table 5-13 Pin-Oscillator Frequency, Ports Px
          5. 5.13.5.1.2  Typical Characteristics, Pin-Oscillator Frequency
        2. 5.13.5.2 Timer_A and Timer_B
          1. Table 5-14 Timer_A
          2. Table 5-15 Timer_B
        3. 5.13.5.3 eUSCI
          1. Table 5-16 eUSCI (UART Mode) Clock Frequency
          2. Table 5-17 eUSCI (UART Mode)
          3. Table 5-18 eUSCI (SPI Master Mode) Clock Frequency
          4. Table 5-19 eUSCI (SPI Master Mode)
          5. Table 5-20 eUSCI (SPI Slave Mode)
          6. Table 5-21 eUSCI (I2C Mode)
        4. 5.13.5.4 LCD Controller
          1. Table 5-22 LCD_C, Recommended Operating Conditions
          2. Table 5-23 LCD_C Electrical Characteristics
        5. 5.13.5.5 ADC
          1. Table 5-24 12-Bit ADC, Power Supply and Input Range Conditions
          2. Table 5-25 12-Bit ADC, Timing Parameters
          3. Table 5-26 12-Bit ADC, Linearity Parameters With External Reference
          4. Table 5-27 12-Bit ADC, Dynamic Performance for Differential Inputs With External Reference
          5. Table 5-28 12-Bit ADC, Dynamic Performance for Differential Inputs With Internal Reference
          6. Table 5-29 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With External Reference
          7. Table 5-30 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With Internal Reference
          8. Table 5-31 12-Bit ADC, Dynamic Performance With 32.768-kHz Clock
          9. Table 5-32 12-Bit ADC, Temperature Sensor and Built-In V1/2
          10. Table 5-33 12-Bit ADC, External Reference
        6. 5.13.5.6 Reference
          1. Table 5-34 REF, Built-In Reference
        7. 5.13.5.7 Comparator
          1. Table 5-35 Comparator_E
        8. 5.13.5.8 Scan Interface
          1. Table 5-36 Extended Scan Interface, Port Drive, Port Timing
          2. Table 5-37 Extended Scan Interface, Sample Capacitor/Ri Timing
          3. Table 5-38 Extended Scan Interface, VCC/2 Generator
          4. Table 5-39 Extended Scan Interface, 12-Bit DAC
          5. Table 5-40 Extended Scan Interface, Comparator
          6. Table 5-41 Extended Scan Interface, ESICLK Oscillator and TSM Clock Signals
        9. 5.13.5.9 FRAM Controller
          1. Table 5-42 FRAM
      6. 5.13.6 Emulation and Debug
        1. Table 5-43 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
      1. 6.3.1 Peripherals in Low-Power Modes
        1. 6.3.1.1 Idle Currents of Peripherals in LPM3 and LPM4
    4. 6.4  Interrupt Vector Table and Signatures
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  FRAM
    8. 6.8  RAM
    9. 6.9  Tiny RAM
    10. 6.10 Memory Protection Unit Including IP Encapsulation
    11. 6.11 Peripherals
      1. 6.11.1  Digital I/O
      2. 6.11.2  Oscillator and Clock System (CS)
      3. 6.11.3  Power-Management Module (PMM)
      4. 6.11.4  Hardware Multiplier (MPY)
      5. 6.11.5  Real-Time Clock (RTC_C)
      6. 6.11.6  Watchdog Timer (WDT_A)
      7. 6.11.7  System Module (SYS)
      8. 6.11.8  DMA Controller
      9. 6.11.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.11.10 Extended Scan Interface (ESI)
      11. 6.11.11 Timer_A TA0, Timer_A TA1
      12. 6.11.12 Timer_A TA2
      13. 6.11.13 Timer_A TA3
      14. 6.11.14 Timer_B TB0
      15. 6.11.15 ADC12_B
      16. 6.11.16 Comparator_E
      17. 6.11.17 CRC16
      18. 6.11.18 CRC32
      19. 6.11.19 True Random Seed
      20. 6.11.20 Shared Reference (REF_A)
      21. 6.11.21 LCD_C
      22. 6.11.22 Embedded Emulation
        1. 6.11.22.1 Embedded Emulation Module (EEM)
        2. 6.11.22.2 EnergyTrace++™ Technology
      23. 6.11.23 Input/Output Diagrams
        1. 6.11.23.1  Digital I/O Functionality – Ports P1 to P10
        2. 6.11.23.2  Capacitive Touch Functionality Ports P1 to P10 and PJ
        3. 6.11.23.3  Port P1 (P1.0 to P1.3) Input/Output With Schmitt Trigger
        4. 6.11.23.4  Port P1 (P1.4 to P1.7) Input/Output With Schmitt Trigger
        5. 6.11.23.5  Port P2 (P2.0 to P2.3) Input/Output With Schmitt Trigger
        6. 6.11.23.6  Port P2 (P2.4 to P2.7) Input/Output With Schmitt Trigger
        7. 6.11.23.7  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
        8. 6.11.23.8  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
        9. 6.11.23.9  Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
        10. 6.11.23.10 Port P6 (P6.0 to P6.6) Input/Output With Schmitt Trigger
        11. 6.11.23.11 Port P6 (P6.7) Input/Output With Schmitt Trigger
        12. 6.11.23.12 Port P7 (P7.0 to P7.7) Input/Output With Schmitt Trigger
        13. 6.11.23.13 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
        14. 6.11.23.14 Port P8 (P8.4 to P8.7) Input/Output With Schmitt Trigger
        15. 6.11.23.15 Port P9 (P9.0 to P9.3) Input/Output With Schmitt Trigger
        16. 6.11.23.16 Port P9 (P9.4 to P9.7) Input/Output With Schmitt Trigger
        17. 6.11.23.17 Port P10 (P10.0 to P10.2) Input/Output With Schmitt Trigger
        18. 6.11.23.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
        19. 6.11.23.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
        20. 6.11.23.20 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors (TLV)
    13. 6.13 Memory
      1. 6.13.1 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
      2. 7.2.2 LCD_C Peripheral
        1. 7.2.2.1 Partial Schematic
        2. 7.2.2.2 Design Requirements
        3. 7.2.2.3 Detailed Design Procedure
        4. 7.2.2.4 Layout Guidelines
      3. 7.2.3 Extended Scan Interface (ESI) Peripheral
        1. 7.2.3.1 Overview
        2. 7.2.3.2 Design Requirements
        3. 7.2.3.3 Detailed Design Procedure
        4. 7.2.3.4 Layout Guidelines
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 5-5 High-Frequency Crystal Oscillator, HFXT(5)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
IDVCC.HFXT HFXT oscillator crystal current HF mode at typical ESR fOSC = 4 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 0, HFFREQ = 1(8)
TA = 25°C, CL,eff = 18 pF, Typical ESR, Cshunt
3.0 V 75 μA
fOSC = 8 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 1, HFFREQ = 1,
TA = 25°C, CL,eff = 18 pF, Typical ESR, Cshunt
120
fOSC = 16 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 2, HFFREQ = 2,
TA = 25°C, CL,eff = 18 pF, Typical ESR, Cshunt
190
fOSC = 24 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 3, HFFREQ = 3,
TA = 25°C, CL,eff = 18 pF, Typical ESR, Cshunt
250
fHFXT HFXT oscillator crystal frequency, crystal mode HFXTBYPASS = 0, HFFREQ = 1(8)(7) 4 8 MHz
HFXTBYPASS = 0, HFFREQ = 2(7) 8.01 16
HFXTBYPASS = 0, HFFREQ = 3(7) 16.01 24
DCHFXT HFXT oscillator duty cycle Measured at SMCLK, fHFXT = 16 MHz 40% 50% 60%
fHFXT,SW HFXT oscillator logic-level square-wave input frequency, bypass mode HFXTBYPASS = 1, HFFREQ = 0(6)(7) 0.9 4 MHz
HFXTBYPASS = 1, HFFREQ = 1(6)(7) 4.01 8
HFXTBYPASS = 1, HFFREQ = 2(6)(7) 8.01 16
HFXTBYPASS = 1, HFFREQ = 3(6)(7) 16.01 24
DCHFXT, SW HFXT oscillator logic-level square-wave input duty cycle HFXTBYPASS = 1 40% 60%
tSTART,HFXT Start-up time(9) fOSC = 4 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 0, HFFREQ = 1,
TA = 25°C, CL,eff = 16 pF
3.0 V 1.6 ms
fOSC = 24 MHz ,
HFXTBYPASS = 0, HFXTDRIVE = 3, HFFREQ = 3,
TA = 25°C, CL,eff = 16 pF
3.0 V 0.6
CHFXIN Integrated load capacitance at HFXIN terminaI(1)(2) 2 pF
CHFXOUT Integrated load capacitance at HFXOUT terminaI(1)(2) 2 pF
fFault,HFXT Oscillator fault frequency(4)(3) 0 800 kHz
This represents all the parasitic capacitance present at the HFXIN and HFXOUT terminals, respectively, including parasitic bond and package capacitance. The effective load capacitance, CL,eff can be computed as CIN × COUT / (CIN + COUT), where CIN and COUT are the total capacitance at the HFXIN and HFXOUT terminals, respectively.
Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended effective load capacitance values supported are 14 pF, 16 pF, and 18 pF. Maximum shunt capacitance of 7 pF. The PCB adds additional capacitance, so it must also be considered in the overall capacitance. Verify that the recommended effective load capacitance of the selected crystal is met.
Measured with logic-level input frequency but also applies to operation with crystals.
Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX might set the flag. A static condition or stuck at fault condition set the flag.
To improve EMI on the HFXT oscillator, observe the following guidelines.
  • Keep the traces between the device and the crystal as short as possible.
  • Design a good ground plane around the oscillator pins.
  • Prevent crosstalk from other clock or data lines into oscillator pins HFXIN and HFXOUT.
  • Avoid running PCB traces underneath or adjacent to the HFXIN and HFXOUT pins.
  • Use assembly materials and processes that avoid any parasitic load on the oscillator HFXIN and HFXOUT pins.
  • If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
When HFXTBYPASS is set, HFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this data sheet. Duty cycle requirements are defined by DCHFXT, SW.
Maximum frequency of operation of the entire device cannot be exceeded.
HFFREQ = \{0\} is not supported for HFXT crystal mode of operation.
Includes start-up counter of 1024 clock cycles.

Table 5-6 lists the characteristics of the DCO.