SLLSEQ6A September   2016  – September 2016 ONET1131EC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Timing Diagram Definitions
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Equalizer
      2. 7.3.2 CDR
      3. 7.3.3 Modulator Driver
      4. 7.3.4 Modulation Current Generator
      5. 7.3.5 DC Offset Cancellation and Cross Point Control
      6. 7.3.6 Bias Current Generation and APC Loop
      7. 7.3.7 Laser Safety Features and Fault Recovery Procedure
      8. 7.3.8 Analog Block
        1. 7.3.8.1 Analog Reference and Temperature Sensor
        2. 7.3.8.2 Power-On Reset
        3. 7.3.8.3 Analog to Digital Converter
          1. 7.3.8.3.1 Temperature
          2. 7.3.8.3.2 Power Supply Voltage
          3. 7.3.8.3.3 Photodiode Current Monitor
          4. 7.3.8.3.4 Bias Current Monitor
        4. 7.3.8.4 2-Wire Interface and Control Logic
        5. 7.3.8.5 Bus Idle
        6. 7.3.8.6 Start Data Transfer
        7. 7.3.8.7 Stop Data Transfer
        8. 7.3.8.8 Data Transfer
      9. 7.3.9 Acknowledge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Differential Transmitter Output
      2. 7.4.2 Single-Ended Transmitter Output
    5. 7.5 Programming
    6. 7.6 Register Mapping
      1. 7.6.1 R/W Control Registers
        1. 7.6.1.1 Core Level Register 0 (offset = 0100 0001 [reset = 41h]
        2. 7.6.1.2 Core Level Register 1 (offset = 0000 0000) [reset = 0h]
        3. 7.6.1.3 Core Level Register 2 (offset = 0000 0000 ) [reset = 0h]
        4. 7.6.1.4 Core Level Register 3 (offset = 0000 0000) [reset = 0h]
      2. 7.6.2 TX Registers
        1. 7.6.2.1  TX Register 10 (offset = 0000 0000) [reset = 0h]
        2. 7.6.2.2  TX Register 11 (offset = 0000 0000) [reset = 0h]
        3. 7.6.2.3  TX Register 12 (offset = 0000 0000) [reset = 0h]
        4. 7.6.2.4  TX Register 13 (offset = 0h) [reset = 0]
        5. 7.6.2.5  TX Register 14 (offset = 0000 0000) [reset = 0h]
        6. 7.6.2.6  TX Register 15 (offset = 0000 0000) [reset = 0h]
        7. 7.6.2.7  TX Register 16 (offset = 0000 0000) [reset = 0h]
        8. 7.6.2.8  TX Register 17 (offset = 0000 0000) [reset = 0h]
        9. 7.6.2.9  TX Register 18 (offset = 0000 0000) [reset = 0h]
        10. 7.6.2.10 TX Register 19 (offset = 0000 0000) [reset = 0h]
      3. 7.6.3 Reserved Registers
        1. 7.6.3.1 Reserved Registers 20-39
      4. 7.6.4 Read Only Registers
        1. 7.6.4.1 Core Level Register 40 (offset = 0000 0000) [reset = 0h]
        2. 7.6.4.2 Core Level Register 41 (offset = 0000 0000) [reset = 0h]
        3. 7.6.4.3 TX Register 43 (offset = 0000 0000) [reset = 0h]
      5. 7.6.5 Adjustment Registers
        1. 7.6.5.1 Adjustment Registers 44-50
        2. 7.6.5.2 Adjustment Register 51 (offset = 0100 0000) [reset = 40h]
        3. 7.6.5.3 Adjustment Registers 52-55
  8. 8 Application Information and Implementations
    1. 8.1 Application Information
    2. 8.2 Typical Application, Transmitter Differential Mode
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
      4. 8.2.4 Typical Application, Transmitter Single-Ended Mode
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.