SBOS377L October   2006  – January 2020 OPA211

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Input Voltage Noise Density vs Frequency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA211
    2.     Pin Functions: OPA2211
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA211 and OPA211A
    5. 6.5 Thermal Information: OPA2211 and OPA2211A
    6. 6.6 Electrical Characteristics: Standard Grade OPAx211A
    7. 6.7 Electrical Characteristics: High-Grade OPAx211
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion Measurements
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operating Voltage
      2. 8.1.2 Input Protection
      3. 8.1.3 Noise Performance
      4. 8.1.4 Basic Noise Calculations
      5. 8.1.5 EMI Rejection
      6. 8.1.6 EMIRR +IN Test Configuration
      7. 8.1.7 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 SON Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from K Revision (September 2018) to L Revision

  • Deleted NOM value from supply voltage in the Recommended Operating Conditions table Go
  • Changed operating temperature to specified temperature in Recommended Operating Conditons table, and changed MIN and MAX from –55°C and +150°C to –40°C and +125°C, respectivelyGo
  • Changed electrical characteristics table titles to clarify difference between standard and high-grade devicesGo

Changes from J Revision (February 2018) to K Revision

  • Changed format of GPN from "OPA2x11" to "OPAx211" Go
  • Corrected system-generated errors: "Time" units from "ms/div" back to "µs/div" and unit for resistors from "W" back to "Ω" in Typical CharacteristicsGo
  • Corrected system-generated error in unit for resistors from "W" back to "Ω" in Figure 43Go
  • Reverted Figure 51 back to that of rev. I Go

Changes from I Revision (June 2016) to J Revision

  • Changed product status from mixed product status to production data Go
  • Deleted Device Comparison table Go
  • Changed formatting of document reference in EMI Rejection sectionGo
  • Changed formatting of document references in SON Layout Guidelines sectionGo
  • Changed formatting of document references in Related Documentation sectionGo

Changes from H Revision (November 2015) to I Revision

  • Changed the SON pin number for V+ from 4 to 7 in the Pin Functions: OPA211 table Go
  • Changed the SON pin number for V- From: 7 To: 4 in the Pin Functions: OPA211 table Go

Changes from G Revision (May 2009) to H Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go