SBOS789C August   2017  – February 2020 OPA2810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Multichannel Sensor Interface
      2.      Harmonic Distortion vs Frequency
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: 10 V
    6. 7.6  Electrical Characteristics: 24 V
    7. 7.7  Electrical Characteristics: 5 V
    8. 7.8  Typical Characteristics: VS = 10 V
    9. 7.9  Typical Characteristics: VS = 24 V
    10. 7.10 Typical Characteristics: VS = 5 V
    11. 7.11 Typical Characteristics: ±2.375 V to ±12 V Split Supply
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 OPA2810 Architecture
      2. 8.3.2 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±2.375 V to ±13.5 V)
      2. 8.4.2 Single-Supply Operation (4.75 V to 27 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Selection of Feedback Resistors
      2. 9.1.2 Noise Analysis and the Effect of Resistor Elements on Total Noise
    2. 9.2 Typical Applications
      1. 9.2.1 Transimpedance Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Multichannel Sensor Interface
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1.1 Thermal Considerations

The OPA2810 does not require heat sinking or airflow in most applications. Maximum allowed junction temperature sets the maximum allowed internal power dissipation. Do not allow the maximum junction temperature to exceed 150°C.

Operating junction temperature (TJ) is given by TA + PD × θJA. The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in the output stage (PDL) to deliver load power. Quiescent power is the specified no-load supply current times the total supply voltage across the part. PDL depends on the required output signal and load but would, for a grounded resistive load, be at a maximum when the output is fixed at a voltage equal to half of either supply voltage (for equal split-supplies). Under this condition PDL = VS2 / (4 × RL) where RL includes feedback network loading.

The power in the output stage and not into the load that determines internal power dissipation.

As a worst-case example, compute the maximum TJ using an OPA2810-DGK (VSSOP package) configured as a unity gain buffer, operating on ±12-V supplies at an ambient temperature of 25°C and driving a grounded 500-Ω load.

PD = 24 V × 9 mA + 122 /(4 × 500 Ω) = 288 mW

Maximum TJ = 25°C + (0.288 W × 177.2°C/W) = 76°C, which is well below the maximum allowed junction temperature of 150oC.