SBOS100B July   1999  – January 2016 OPA551 , OPA552

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = ±30 V
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Input Protection
      3. 7.3.3 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitive Loads
        2. 8.2.2.2 Increasing Output Current
        3. 8.2.2.3 Using the OPA552 in Low Gains
        4. 8.2.2.4 Offset Voltage Error Calculation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supplies
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Safe Operating Area
    5. 10.5 Heat Sinking
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Links
      2. 11.2.2 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

9.1 Power Supplies

The OPA55x may be operated from power supplies of ±4 V to ±30 V, or a total of 60 V with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltage are shown in the Typical Characteristics.

For applications that do not require symmetrical output voltage swing, power-supply voltages do not need to be equal. The OPA55x can operate with as little as 8 V between the supplies or with up to 60 V between the supplies. For example, the positive supply could be set to 50 V with the negative supply at –10 V, or vice-versa.

The SOIC-8 package outline shows three negative supply (V–) pins. These pins are internally connected for improved thermal performance.

NOTE

Pin 4 must be used as the primary current carrier for the negative supply. It is recommended that pins 1 and 5 are not directly connected to V–. Instead, connect pins 1 and 5 to a thermal mass. DO NOT lay out the printed-circuit-board (PCB) to use pins 1 and 5 as feedthroughs to the negative supply. Such a configuration results in a performance reduction.

The tab of the DDPAK/TO-263 package is electrically connected to the negative supply (V–). However, this connection must not be used to carry current. For best thermal performance, solder the tab directly to the PCB copper area (see the Heat Sinking section).