SLES230A September   2008  – August 2015 PCM2912A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
      1. 7.6.1 ADC Digital Decimation Filter Frequency Response
      2. 7.6.2 ADC Digital High-Pass Filter Frequency Response
      3. 7.6.3 ADC Analog Antialiasing Filter Frequency Response
      4. 7.6.4 DAC Digital Interpolation Filter Frequency Response
      5. 7.6.5 DAC Analog FIR Filter Frequency Response
      6. 7.6.6 DAC Analog Low-Pass Filter Frequency Response
      7. 7.6.7 ADC
      8. 7.6.8 DAC
      9. 7.6.9 Supply Current
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Clock and Reset
      2. 9.3.2  DAC
      3. 9.3.3  ADC
      4. 9.3.4  Microphone Bias
      5. 9.3.5  Microphone Amplifier
      6. 9.3.6  Input PGA
      7. 9.3.7  Sidetone Programmable Attenuator
      8. 9.3.8  Output Programmable Attenuator
      9. 9.3.9  VCOM1 and VCCM2
      10. 9.3.10 Filter Pins
      11. 9.3.11 Interface Sequence
        1. 9.3.11.1 Power-On, Attach, and Play Back Sequence
        2. 9.3.11.2 Play, Stop, and Detach Sequence
        3. 9.3.11.3 Record Sequence
        4. 9.3.11.4 Suspend and Resume Sequence
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 USB Interface
        1. 9.5.1.1 Device Configuration
        2. 9.5.1.2 Interface #0
        3. 9.5.1.3 Interface #1
        4. 9.5.1.4 Interface #2
        5. 9.5.1.5 Endpoints
        6. 9.5.1.6 Internal Regulator
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation, see the following:

  • Operating Envronments for PCM2912 Applications, SLAA387
  • EVM User's Guide, SBAU141

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

SpAct, E2E are trademarks of Texas Instruments.

Audio Precision, System Two are trademarks of Audio Precision, Inc..

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.