SBOS283D September   2003  – March 2018 REF1112

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Shunt Reference Application Schematic
      2.      Pinout
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Shunt Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 MicroPOWER 3-μA, 1-V Voltage Reference
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 2.5-V Reference on 1 μA
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 Adjustable Voltage Shunt Reference
      5. 8.2.5 Level Shift to Achieve Full ADC Input Range
      6. 8.2.6 Stable Current Source
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Typical Characteristics

At TA = +25°C, IREF = 10 μA and CLOAD = 10 nF, unless otherwise noted.
REF1112 typical-characteristic-01-reverse-characteristics-sbos238.gif
Figure 1. Reverse Characteristics
REF1112 typical-characteristic-03-temperature-drift-sbos238.gif
Figure 3. Temperature Drift
REF1112 typical-characteristic-05-reverse-dynamic-impedance-sbos238.gif
Figure 5. Reverse Dynamic Impedance
REF1112 typical-characteristic-07-reverse-breakdown-voltage-distribution-sbos238.gif
Figure 7. Reverse Breakdown Voltage Distribution
REF1112 typical-characteristic-09-temperature-drift-distribution-sbos238.gif
Figure 9. Temperature Drift Distribution
REF1112 typical-characteristic-11-response-time-sbos238.gif
Figure 11. Response Time
REF1112 typical-characteristic-02-forward-characteristics-sbos238.gif
Figure 2. Forward Characteristics
REF1112 typical-characteristic-04-release-voltage-change-v-current-sbos238.gif
Figure 4. Reverse Voltage Change vs Current
REF1112 typical-characteristic-06-reverse-dynamic-impedance-sbos238.gif
Figure 6. Reverse Dynamic Impedance
REF1112 typical-characteristic-08-temperature-drift-distribution-sbos238.gif
Figure 8. Temperature Drift Distribution
REF1112 typical-characteristic-10-low-frequency-noise-to-10hz-sbos238.gif
Figure 10. Low-Frequency Noise, 0.1 to 10Hz
REF1112 typical-characteristic-12-response-time-sbos238.gif
Figure 12. Response Time