SBOS410H June   2007  – June 2016 REF5010 , REF5020 , REF5025 , REF5030 , REF5040 , REF5045 , REF5050

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Temperature Monitoring
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Thermal Hysteresis
      4. 9.3.4 Noise Performance
      5. 9.3.5 Output Adjustment Using the TRIM/NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Supply Voltage
      3. 9.4.3 Negative Reference Voltage
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 16-bit, 250-KSPS Data Acquisition System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

  • Place the power-supply bypass capacitor as closely as possible to the supply and ground pins. The recommended value of this bypass capacitor is from 1 μF to 10 μF. If necessary, additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.
  • Place a 1-μF noise filtering capacitor between the NR pin and ground.
  • The output must be decoupled with a 1-μF to 50-μF capacitor. A resistor in series with the output capacitor is optional. For better noise performance, the recommended ESR on the output capacitor is from 1 Ω to 1.5 Ω.
  • A high-frequency, 1-μF capacitor can be added in parallel between the output and ground to filter noise and help with switching loads as data converters.

12.2 Layout Example

REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 Layout_BOS410.gif Figure 44. Layout Example

12.3 Power Dissipation

The REF50xx family is specified to deliver current loads of ±10 mA over the specified input voltage range. The temperature of the device increases according to Equation 4:

Equation 4. TJ = TA + PD × θJA

where

  • TJ = Junction temperature (°C)
  • TA = Ambient temperature (°C)
  • PD = Power dissipated (W)
  • θJA = Junction-to-ambient thermal resistance (°C/W)

The REF50xx junction temperature must not exceed the absolute maximum rating of 150°C.