SBOS410H June   2007  – June 2016 REF5010 , REF5020 , REF5025 , REF5030 , REF5040 , REF5045 , REF5050

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Temperature Monitoring
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Thermal Hysteresis
      4. 9.3.4 Noise Performance
      5. 9.3.5 Output Adjustment Using the TRIM/NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Supply Voltage
      3. 9.4.3 Negative Reference Voltage
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 16-bit, 250-KSPS Data Acquisition System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (November 2015) to H Revision

  • Changed all (Maximum) to (Max) in Features section Go
  • Changed MSOP to VSSOP and SO to SOIC throughout document Go
  • Added TI Design Go
  • Changed first Applications bullet Go
  • Changed last paragraph of Description section Go
  • Changed Simplified SchematicGo
  • Changed device name in Recommended Operating Conditions table footnote Go
  • Added Output Voltage and Noise sections to Electrical Characteristics table Go
  • Changed third bullet in Layout Guidelines section Go

Changes from F Revision (December 2013) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from E Revision (June 2010) to F Revision

Changes from D Revision (April 2009) to E Revision

  • Updated Features list; added Excellent Long-Term Stability bullet Go
  • Added Thermal Hysteresis parameters and specificationsGo
  • Added Long-Term Stability parameters and specificationsGo
  • Added Figure 22 through Figure 24Go
  • Added Figure 25 through Figure 27Go
  • Added Thermal Hysteresis sectionGo
  • Revised Noise Performance section; added paragraph with links to applications articlesGo

Changes from C Revision (December 2008) to D Revision

  • Removed all notes regarding MSOP-8 package status. MSOP-8 package released at time of document revisionGo
  • Changed Storage Temperature Range absolute minimum value from –55°C to –65°CGo
  • Added Load Regulation test condition and Over Temperature specificationsGo
  • Added typical characteristic graph, Quiescent Current vs Input Voltage (Figure 10)Go