SLAS916C November 2012 – November 2014 RF430CL330H
For more information on the RF430 family of devices and the tools and software that are available to help with your development, visit the Tools & Software for NFC / RFID page.
The Dynamic Near Field Communication (NFC) Type 4B Tag design (TIDM-DYNAMICNFCTAG) outlines the required components, layout considerations, and provides firmware examples to implement NFC into applications such as Bluetooth/Wi-Fi pairing, equipment configuration and diagnostics, or as a general purpose NFC data interface. The documentation, hardware, and example code provided allows the designer to quickly implement NFC functionality with an MSP430™ MCU or other MCU of choice.
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all RF430 MCU devices and support tools. Each commercial family member has one of three prefixes: RF, P, or X (for example, RF430CL330H). Texas Instruments recommends two of three possible prefix designators for its support tools: RF and X. These prefixes represent evolutionary stages of product development from engineering prototypes (with X for devices and tools) through fully qualified production devices and tools (with RF for devices tools).
Device development evolutionary flow:
X – Experimental device that is not necessarily representative of the final device's electrical specifications
P – Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification
RF – Fully qualified production device
Support tool development evolutionary flow:
X – Development-support product that has not yet completed Texas Instruments internal qualification testing.
RF – Fully-qualified development-support product
X and P devices and X development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
RF devices and RF development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X and P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGE) and temperature range (for example, T). Figure 6-1 provides a legend for reading the complete device name for any family member.
The following documents describe the RF430CL330H device. Copies of these documents are available on the Internet at www.ti.com.
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
MSP430, E2E are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.