SCLS252N October   1995  – February 2018 SN54AHCT240 , SN74AHCT240

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
  7. 7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|20
  • J|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74AHCT240UNIT
DWDBNNSPW
20 PINS20 PINS20 PINS20 PINS20 PINS
RθJA Junction-to-ambient thermal resistance 83.0 99.9 54.9 80.4 105.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.9 61.7 41.7 46.9 39.5
RθJB Junction-to-board thermal resistance 50.5 55.2 35.8 47.9 56.4
ψJT Junction-to-top characterization parameter 21.1 22.6 27.9 19.9 3.1
ψJB Junction-to-board characterization parameter 50.1 54.8 35.7 47.5 55.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.