Changes from Revision Q (July 2005) to Revision R (March 2024)
- Added Package Information table, Pin Functions table, ESD
Ratings table, Thermal Information table, Device Functional
Modes,Application and Implementation section, Device and Documentation Support
section, and Mechanical, Packaging, and Orderable Information section Go
- Added BQA package to Package Information table, Pin
Configuration and Functions section, and Thermal Information
table Go