4 Revision History
Changes from L Revision (October 2016) to M Revision
- Changed the pin images appearance Go
- Changed the Thermal Information table Go
Changes from K Revision (April 2015) to L Revision
- Added TSSOP (16) to Device Information tableGo
- Added Junction temperature, TJ in Absolute Maximum RatingsGo
- Changed wording in Detailed Design Procedure to clarify device operationGo
- Added Receiving Notification of Documentation Updates section and Community Resources sectionGo
Changes from J Revision (December 2012) to K Revision
- Removed Ordering Information table, see Mechanical, Packaging, and Orderable InformationGo
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
- Added Applications.Go
- Added Device Information table.Go
Changes from I Revision (October 2003) to J Revision
- Added QFN ordering info and package pinout Go