SCLS094E December   1982  – December 2015 SN54HC74 , SN74HC74

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
IIK Input clamp current(2) VI < 0 or VI > VCC ±20 mA
IOK Output clamp current(2) VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±50 mA
Tj Junction temperature range 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

See (1)
SN54HC74 SN74HC74 UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 2 5 6 2 5 6 V
VIH High-level input voltage VCC = 2 V 1.5 1.5 V
VCC = 4.5 V 3.15 3.15
VCC = 6 V 4.2 4.2
VIL Low-level input voltage VCC = 2 V 0.5 0.5 V
VCC = 4.5 V 1.35 1.35
VCC = 6 V 1.8 1.8
VI Input voltage 0 VCC 0 VCC V
VO Output voltage 0 VCC 0 VCC V
∆t/∆v Input transition rise and fall time VCC = 2 V 1000 1000 ns
VCC = 4.5 V 500 500
VCC = 6 V 400 400
TA Operating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74HC74 SN54HC74 UNIT
D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) J (CDIP) W (CFP) FK (LCCC)
14 PINS 14 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 86 96 80 76 113 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.05 14.65 5.61
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VOH VI = VIH or VIL IOH = –20 µA 2 V 1.9 1.998 V
4.5 V 4.4 4.499
6 V 5.9 5.999
IOH = –4 mA TA = 25°C 4.5 V 3.98 4.3
SN54HC74 3.7
SN74HC74 3.84
IOH = –5.2 mA TA = 25°C 6 V 5.48 5.8
SN54HC74 5.2
SN74HC74 5.34
VOL VI = VIH or VIL IOL = 20 µA 2 V 0.002 0.1 V
4.5 V 0.001 0.1
6 V 0.001 0.1
IOL = 4 mA TA = 25°C 4.5 V 0.17 0.26
SN54HC74 0.4
SN74HC74 0.33
IOL = 5.2 mA TA = 25°C 6 V 0.15 0.26
SN54HC74 0.4
SN74HC74 0.33
II VI = VCC or 0 TA = 25°C 6 V ±0.1 ±100 nA
SN54HC74, SN74HC74 ±1000
ICC VI = VCC or 0, IO = 0 TA = 25°C 6 V 4 µA
SN54HC74 80
SN74HC74 40
Ci 2 V to 6 V 3 10 pF
Cpd No load 2 V to 6 V 35 pF

6.6 Timing Requirements

over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)
VCC TA MIN MAX UNIT
fclock Clock frequency 2 V TA = 25°C 6 MHz
SN54HC74 4.2
SN74HC74 5
4.5 V TA = 25°C 31
SN54HC74 21
SN74HC74 25
6 V TA = 25°C 0 36
SN54HC74 0 25
SN74HC74 0 29
tw Pulse duration PRE or CLR low 2 V TA = 25°C 100 ns
SN54HC74 150
SN74HC74 125
4.5 V TA = 25°C 20
SN54HC74 30
SN74HC74 25
6 V TA = 25°C 14
SN54HC74 25
SN74HC74 21
CLK high or low 2 V TA = 25°C 80
SN54HC74 120
SN74HC74 100
4.5 V TA = 25°C 16
SN54HC74 24
SN74HC74 20
6 V TA = 25°C 14
SN54HC74 20
SN74HC74 17
tsu Setup time before CLK↑ Data 2 V TA = 25°C 100 ns
SN54HC74 150
SN74HC74 125
4.5 V TA = 25°C 20
SN54HC74 30
SN74HC74 25
6 V TA = 25°C 17
SN54HC74 25
SN74HC74 21
PRE or CLR inactive 2 V TA = 25°C 25
SN54HC74 40
SN74HC74 30
4.5 V TA = 25°C 5
SN54HC74 8
SN74HC74 6
6 V TA = 25°C 4
SN54HC74 7
SN74HC74 5
th Hold time, data after CLK↑ 2 V 0 ns
4.5 V 0
6 V 0

6.7 Switching Characteristics

over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
VCC TA MIN TYP MAX UNIT
fmax 2 V TA = 25°C 6 10 MHz
SN54HC74 4.2
SN74HC74 6
4.5 V TA = 25°C 31 50
SN54HC74 21
SN74HC74 25
6 V TA = 25°C 36 60
SN54HC74 25
SN74HC74 29
tpd PRE or CLR Q or Q 2 V TA = 25°C 70 230 ns
SN54HC74 345
SN74HC74 290
4.5 V TA = 25°C 20 46
SN54HC74 69
SN74HC74 58
6 V TA = 25°C 15 39
SN54HC74 59
SN74HC74 49
CLK Q or Q 2 V TA = 25°C 70 175
SN54HC74 250
SN74HC74 220
4.5 V TA = 25°C 20 35
SN54HC74 50
SN74HC74 44
6 V TA = 25°C 15 30
SN54HC74 42
SN74HC74 37
tt Q or Q 2 V TA = 25°C 28 75 ns
SN54HC74 110
SN74HC74 95
4.5 V TA = 25°C 8 15
SN54HC74 22
SN74HC74 19
6 V TA = 25°C 6 13
SN54HC74 19
SN74HC74 16

6.8 Typical Characteristics

SN54HC74 SN74HC74 SCLS094-tpdcurveCLKtoQ.gif Figure 1. Typical Propagation Delay - CLK to Q