SCES366L August   2001  – October 2015 SN74LVC3G34

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Documentation Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DCT Package
8-Pin SM8
Top View
SN74LVC3G34 po_DCT_ces366.gif
DCU Package
8-Pin VSSOP
Top View
SN74LVC3G34 po_DCU_ces366.gif
YZP Package
8-Pin DSBGA
Bottom View
SN74LVC3G34 po_YZP_ces366.gif

Pin Functions(1)

PIN I/O DESCRIPTION
NAME NO.
1A 1 I Buffer Input 1
1Y 7 O Buffer Output 1
2A 3 I Buffer Input 2
2Y 5 O Buffer Output 2
3A 6 I Buffer Input 3
3Y 2 O Buffer Output 3
GND 4 Ground pin
VCC 8 Power pin
(1) See mechanical drawings for dimensions