SLOS814D March   2014  – September 2016 TAS5421-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Audio Input and Preamplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Gate Drive
      4. 7.3.4 Power FETs
      5. 7.3.5 Load Diagnostics
      6. 7.3.6 Protection and Monitoring
      7. 7.3.7 I2C Serial Communication Bus
        1. 7.3.7.1 I2C Bus Protocol
        2. 7.3.7.2 Random Write
        3. 7.3.7.3 Random Read
        4. 7.3.7.4 Sequential Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Hardware Control Pins
      2. 7.4.2 EMI Considerations
      3. 7.4.3 Operating Modes and Faults
    5. 7.5 Register Maps
      1. 7.5.1 I2C Address Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Amplifier Output Filtering
        2. 8.2.1.2 Amplifier Output Snubbers
        3. 8.2.1.3 Bootstrap Capacitors
        4. 8.2.1.4 Analog Audio Input Filter
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Unused Pin Connections
          1. 8.2.2.1.1 MUTE Pin
          2. 8.2.2.1.2 STANDBY Pin
          3. 8.2.2.1.3 I2C Pins (SDA and SCL)
          4. 8.2.2.1.4 Terminating Unused Outputs
          5. 8.2.2.1.5 Using a Single-Ended Audio Input
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Top Layer
      2. 10.2.2 Second Layer - Signal Layer
      3. 10.2.3 Third Layer - Power Layer
      4. 10.2.4 Bottom Layer - Ground Layer
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resource
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (September 2014) to D Revision

  • Added the FAULT pin to the Input voltage parameters in the Absolute Maximum Ratings table Go
  • Added the MUTE pin to the logic-level high and logic-level low parameters for the STANDBY in the Recommended Operating Conditions tableGo
  • Added the capacitance parameter to the Electrical Characteristics table for the SDA pin in STANDBY modeGo
  • Added the Receiving Notification of Documentation Updates section Go

Changes from B Revision (July 2014) to C Revision

  • Moved Tstg from Handling Ratings table to Absolute Maximum Ratings table Go
  • Changed Handling Ratings table to ESD Ratings Go
  • In "1. Load Diagnostics" paragraph, changed "at start-up" to "on de-assertion of STANDBY" and appended two new sentences Go
  • Changed Section number of I2C Serial Communication Bus from 7.4 to 7.3.7 Go
  • Changed Table 3Go
  • Added disclaimer to beginning of Application and Implementation sectionGo
  • Added Power Supply Recommendations section and moved the contents of former Section 8.2.1.5 hereGo
  • Placed text ahead of graphics for Figure 18 through Figure 21Go
  • Created a Layout Examples section to contain former sections 9.1.1 through 9.1.4Go
  • Added third-party component disclaimerGo

Changes from A Revision (July 2014) to B Revision

  • Changed data-sheet status from PRODUCT PREVIEW to PRODUCTION DATA Go

Changes from * Revision (March 2014) to A Revision

  • Added content to the preliminary data sheet to create the full PRODUCT PREVIEW data sheet Go