SPRS958H March   2016  – November 2019

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Ports (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.4.5  External Memory Interface (EMIF SDRAM)
      6. 4.4.6  General-Purpose Memory Controller (GPMC)
      7. 4.4.7  Timers
      8. 4.4.8  Inter-Integrated Circuit Interface (I2C)
      9. 4.4.9  Universal Asynchronous Receiver Transmitter (UART)
      10. 4.4.10 Multichannel Serial Peripheral Interface (McSPI)
      11. 4.4.11 Quad Serial Peripheral Interface (QSPI)
      12. 4.4.12 Multichannel Audio Serial Port (McASP)
      13. 4.4.13 Universal Serial Bus (USB)
      14. 4.4.14 SATA
      15. 4.4.15 Peripheral Component Interconnect Express (PCIe)
      16. 4.4.16 Controller Area Network Interface (DCAN)
      17. 4.4.17 Ethernet Interface (GMAC_SW)
      18. 4.4.18 eMMC/SD/SDIO
      19. 4.4.19 General-Purpose Interface (GPIO)
      20. 4.4.20 Pulse Width Modulation (PWM) Interface
      21. 4.4.21 Test Interfaces
      22. 4.4.22 System and Miscellaneous
        1. 4.4.22.1 Sysboot
        2. 4.4.22.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.22.3 Real-Time Clock (RTC) Interface
        4. 4.4.22.4 System Direct Memory Access (SDMA)
        5. 4.4.22.5 Interrupt Controllers (INTC)
        6. 4.4.22.6 Observability
      23. 4.4.23 Power Supplies
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On-Hour (POH) Limits
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6  Power Consumption Summary
    7. 5.7  Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  LVCMOS CSI2 DC Electrical Characteristics
      8. 5.7.8  BC1833IHHV Buffers DC Electrical Characteristics
      9. 5.7.9  USBPHY DC Electrical Characteristics
      10. 5.7.10 Dual Voltage SDIO1833 DC Electrical Characteristics
      11. 5.7.11 Dual Voltage LVCMOS DC Electrical Characteristics
      12. 5.7.12 SATAPHY DC Electrical Characteristics
      13. 5.7.13 PCIEPHY DC Electrical Characteristics
    8. 5.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. Table 5-19 Recommended Operating Conditions for OTP eFuse Programming
      2. 5.8.1      Hardware Requirements
      3. 5.8.2      Programming Sequence
      4. 5.8.3      Impact to Your Hardware Warranty
    9. 5.9  Thermal Characteristics
      1. 5.9.1 Package Thermal Characteristics
    10. 5.10 Power Supply Sequences
  6. 6 Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
        3. 6.1.4.3 RC On-die Oscillator Clock
    2. 6.2 DPLLs, DLLs Specifications
      1. 6.2.1 DPLL Characteristics
      2. 6.2.2 DLL Characteristics
      3. 6.2.3 DPLL and DLL Noise Isolation
  7. 7 Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem - Video Output Ports
    8. 7.8  Display Subsystem - High-Definition Multimedia Interface (HDMI)
    9. 7.9  Camera Serial Interface 2 CAL bridge (CSI2)
      1. 7.9.1 CSI-2 MIPI D-PHY
    10. 7.10 External Memory Interface (EMIF)
    11. 7.11 General-Purpose Memory Controller (GPMC)
      1. 7.11.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.11.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.11.3 GPMC/NAND Flash Interface Asynchronous Timing
    12. 7.12 Timers
    13. 7.13 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-33 Timing Requirements for I2C Input Timings
      2. Table 7-34 Timing Requirements for I2C HS-Mode (I2C3/4/5/6 Only)
      3. Table 7-35 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    14. 7.14 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-36 Timing Requirements for UART
      2. Table 7-37 Switching Characteristics Over Recommended Operating Conditions for UART
    15. 7.15 Multichannel Serial Peripheral Interface (McSPI)
    16. 7.16 Quad Serial Peripheral Interface (QSPI)
    17. 7.17 Multichannel Audio Serial Port (McASP)
      1. Table 7-44 Timing Requirements for McASP1
      2. Table 7-45 Timing Requirements for McASP2
      3. Table 7-46 Timing Requirements for McASP3/4/5/6/7/8
    18. 7.18 Universal Serial Bus (USB)
      1. 7.18.1 USB1 DRD PHY
      2. 7.18.2 USB2 PHY
      3. 7.18.3 USB3 DRD ULPI-SDR-Slave Mode-12-pin Mode
    19. 7.19 Serial Advanced Technology Attachment (SATA)
    20. 7.20 Peripheral Component Interconnect Express (PCIe)
    21. 7.21 Controller Area Network Interface (DCAN)
      1. Table 7-64 Timing Requirements for DCANx Receive
      2. Table 7-65 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
    22. 7.22 Ethernet Interface (GMAC_SW)
      1. 7.22.1 GMAC MII Timings
        1. Table 7-66 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-67 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-68 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-69 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.22.2 GMAC MDIO Interface Timings
      3. 7.22.3 GMAC RMII Timings
        1. Table 7-74 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-75 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-76 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-77 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.22.4 GMAC RGMII Timings
        1. Table 7-81 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-82 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-83 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-84 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    23. 7.23 eMMC/SD/SDIO
      1. 7.23.1 MMC1-SD Card Interface
        1. 7.23.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.23.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.23.1.3 SDR12, 4-bit data, half-cycle
        4. 7.23.1.4 SDR25, 4-bit data, half-cycle
        5. 7.23.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.23.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.23.1.7 UHS-I DDR50, 4-bit data
      2. 7.23.2 MMC2 - eMMC
        1. 7.23.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.23.2.2 High Speed JC64 SDR, 8-bit data, half cycle
        3. 7.23.2.3 High Speed HS200 JEDS84, 8-bit data, half cycle
        4. 7.23.2.4 High Speed JC64 DDR, 8-bit data
          1. Table 7-109 Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
      3. 7.23.3 MMC3 and MMC4-SDIO/SD
        1. 7.23.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.23.3.2 MMC3 and MMC4, SD High Speed
        3. 7.23.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.23.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.23.3.5 MMC3 SDIO High Speed UHS-I SDR50 Mode, Half Cycle
    24. 7.24 General-Purpose Interface (GPIO)
    25. 7.25 System and Miscellaneous interfaces
    26. 7.26 Test Interfaces
      1. 7.26.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.26.1.1 JTAG Electrical Data/Timing
          1. Table 7-131 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-132 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-133 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-134 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.26.2 Trace Port Interface Unit (TPIU)
        1. 7.26.2.1 TPIU PLL DDR Mode
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Introduction
      1. 8.1.1 Initial Requirements and Guidelines
    2. 8.2 Power Optimizations
      1. 8.2.1 Step 1: PCB Stack-up
      2. 8.2.2 Step 2: Physical Placement
      3. 8.2.3 Step 3: Static Analysis
        1. 8.2.3.1 PDN Resistance and IR Drop
      4. 8.2.4 Step 4: Frequency Analysis
      5. 8.2.5 System ESD Generic Guidelines
        1. 8.2.5.1 System ESD Generic PCB Guideline
        2. 8.2.5.2 Miscellaneous EMC Guidelines to Mitigate ESD Immunity
        3. 8.2.5.3 ESD Protection System Design Consideration
      6. 8.2.6 EMI / EMC Issues Prevention
        1. 8.2.6.1 Signal Bandwidth
        2. 8.2.6.2 Signal Routing
          1. 8.2.6.2.1 Signal Routing—Sensitive Signals and Shielding
          2. 8.2.6.2.2 Signal Routing—Outer Layer Routing
        3. 8.2.6.3 Ground Guidelines
          1. 8.2.6.3.1 PCB Outer Layers
          2. 8.2.6.3.2 Metallic Frames
          3. 8.2.6.3.3 Connectors
          4. 8.2.6.3.4 Guard Ring on PCB Edges
          5. 8.2.6.3.5 Analog and Digital Ground
    3. 8.3 Core Power Domains
      1. 8.3.1 General Constraints and Theory
      2. 8.3.2 Voltage Decoupling
      3. 8.3.3 Static PDN Analysis
      4. 8.3.4 Dynamic PDN Analysis
      5. 8.3.5 Power Supply Mapping
      6. 8.3.6 DPLL Voltage Requirement
      7. 8.3.7 Loss of Input Power Event
      8. 8.3.8 Example PCB Design
        1. 8.3.8.1 Example Stack-up
        2. 8.3.8.2 vdd Example Analysis
    4. 8.4 Single-Ended Interfaces
      1. 8.4.1 General Routing Guidelines
      2. 8.4.2 QSPI Board Design and Layout Guidelines
    5. 8.5 Differential Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 USB 2.0 Board Design and Layout Guidelines
        1. 8.5.2.1 Background
        2. 8.5.2.2 USB PHY Layout Guide
          1. 8.5.2.2.1 General Routing and Placement
          2. 8.5.2.2.2 Specific Guidelines for USB PHY Layout
            1. 8.5.2.2.2.1  Analog, PLL, and Digital Power Supply Filtering
            2. 8.5.2.2.2.2  Analog, Digital, and PLL Partitioning
            3. 8.5.2.2.2.3  Board Stackup
            4. 8.5.2.2.2.4  Cable Connector Socket
            5. 8.5.2.2.2.5  Clock Routings
            6. 8.5.2.2.2.6  Crystals/Oscillator
            7. 8.5.2.2.2.7  DP/DM Trace
            8. 8.5.2.2.2.8  DP/DM Vias
            9. 8.5.2.2.2.9  Image Planes
            10. 8.5.2.2.2.10 Power Regulators
        3. 8.5.2.3 References
      3. 8.5.3 USB 3.0 Board Design and Layout Guidelines
        1. 8.5.3.1 USB 3.0 interface introduction
        2. 8.5.3.2 USB 3.0 General routing rules
      4. 8.5.4 HDMI Board Design and Layout Guidelines
        1. 8.5.4.1 HDMI Interface Schematic
        2. 8.5.4.2 TMDS General Routing Guidelines
        3. 8.5.4.3 TPD5S115
        4. 8.5.4.4 HDMI ESD Protection Device (Required)
        5. 8.5.4.5 PCB Stackup Specifications
        6. 8.5.4.6 Grounding
      5. 8.5.5 SATA Board Design and Layout Guidelines
        1. 8.5.5.1 SATA Interface Schematic
        2. 8.5.5.2 Compatible SATA Components and Modes
        3. 8.5.5.3 PCB Stackup Specifications
        4. 8.5.5.4 Routing Specifications
      6. 8.5.6 PCIe Board Design and Layout Guidelines
        1. 8.5.6.1 PCIe Connections and Interface Compliance
          1. 8.5.6.1.1 Coupling Capacitors
          2. 8.5.6.1.2 Polarity Inversion
        2. 8.5.6.2 Non-standard PCIe connections
          1. 8.5.6.2.1 PCB Stackup Specifications
          2. 8.5.6.2.2 Routing Specifications
            1. 8.5.6.2.2.1 Impedance
            2. 8.5.6.2.2.2 Differential Coupling
            3. 8.5.6.2.2.3 Pair Length Matching
        3. 8.5.6.3 LJCB_REFN/P Connections
      7. 8.5.7 CSI2 Board Design and Routing Guidelines
        1. 8.5.7.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          1. 8.5.7.1.1 General Guidelines
          2. 8.5.7.1.2 Length Mismatch Guidelines
            1. 8.5.7.1.2.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          3. 8.5.7.1.3 Frequency-domain Specification Guidelines
    6. 8.6 Clock Routing Guidelines
      1. 8.6.1 32-kHz Oscillator Routing
      2. 8.6.2 Oscillator Ground Connection
    7. 8.7 DDR3 Board Design and Layout Guidelines
      1. 8.7.1 DDR3 General Board Layout Guidelines
      2. 8.7.2 DDR3 Board Design and Layout Guidelines
        1. 8.7.2.1  Board Designs
        2. 8.7.2.2  DDR3 EMIF
        3. 8.7.2.3  DDR3 Device Combinations
        4. 8.7.2.4  DDR3 Interface Schematic
          1. 8.7.2.4.1 32-Bit DDR3 Interface
          2. 8.7.2.4.2 16-Bit DDR3 Interface
        5. 8.7.2.5  Compatible JEDEC DDR3 Devices
        6. 8.7.2.6  PCB Stackup
        7. 8.7.2.7  Placement
        8. 8.7.2.8  DDR3 Keepout Region
        9. 8.7.2.9  Bulk Bypass Capacitors
        10. 8.7.2.10 High Speed Bypass Capacitors
          1. 8.7.2.10.1 Return Current Bypass Capacitors
        11. 8.7.2.11 Net Classes
        12. 8.7.2.12 DDR3 Signal Termination
        13. 8.7.2.13 VREF_DDR Routing
        14. 8.7.2.14 VTT
        15. 8.7.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.7.2.15.1 Four DDR3 Devices
            1. 8.7.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.7.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.7.2.15.2 Two DDR3 Devices
            1. 8.7.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.7.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.7.2.15.3 One DDR3 Device
            1. 8.7.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.7.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.7.2.16 Data Topologies and Routing Definition
          1. 8.7.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.7.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.7.2.17 Routing Specification
          1. 8.7.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.7.2.17.2 DQS and DQ Routing Specification
  9. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature and Orderable Information
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABC|760
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Display Subsystem - Video Output Ports

Three Display Parallel Interfaces (DPI) channels are available in DSS named DPI Video Output 1, DPI Video Output 2 and DPI Video Output 3.

NOTE

The DPI Video Output i (i = 1 to 3) interface is also referred to as VOUTi.

Every VOUT interface consists of:

  • 24-bit data bus (data[23:0])
  • Horizontal synchronization signal (HSYNC)
  • Vertical synchronization signal (VSYNC)
  • Data enable (DE)
  • Field ID (FID)
  • Pixel clock (CLK)

NOTE

For more information, see Display Subsystem chapter in the device TRM.

CAUTION

The I/O Timings provided in this section are valid only if signals within a single IOSET are used. The IOSETs are defined in Table 7-18 .

CAUTION

The I/O Timings provided in this section are valid only for some DSS usage modes when the corresponding Virtual I/O Timings or Manual I/O Timings are configured as described in the tables found in this section.

CAUTION

All pads/balls configured as vouti_* signals must be programmed to use slow slew rate by setting the corresponding CTRL_CORE_PAD_*[SLEWCONTROL] register field to SLOW (0b1).

Table 7-14 through Table 7-17, and Figure 7-6 assume testing over the recommended operating conditions and electrical characteristic conditions.

Table 7-14 DPI Video Output i (i = 1..3) Default Switching Characteristics

NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
D1 tc(clk) Cycle time, output pixel clock vouti_clk DPI1/2/3 in 1.8V mode
DPI2 in 3.3V mode		 11.76(3) ns
DPI1/3 in 3.3V mode 13.33(3) ns
D2 tw(clkL) Pulse duration, output pixel clock vouti_clk low P*0.5-1 (1) ns
D3 tw(clkH) Pulse duration, output pixel clock vouti_clk high P*0.5-1 (1) ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI1 -2.5 2.5 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI1 -2.5 2.5 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (vin2a_fld0 clock reference) -2.5 2.5 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (vin2a_fld0 clock reference) -2.5 2.5 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (xref_clk2 clock reference) -2.5 2.5 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (xref_clk2 clock reference) -2.5 2.5 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI3 -2.5 2.5 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI3 -2.5 2.5 ns
  1. P = output vouti_clk period in ns.
  2. All pads/balls configured as vouti_* signals must be programmed to use slow slew rate by setting the corresponding CTRL_CORE_PAD_*[SLEWCONTROL] register field to SLOW (0b1).
  3. SERDES transceivers may be sensitive to the jitter profile of vouti_clk. See Application Note SPRAC62 for additional guidance.

Table 7-15 DPI Video Output i (i = 1..3) Alternate Switching Characteristics(2)

NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
D1 tc(clk) Cycle time, output pixel clock vouti_clk DPI1/2/3 in 1.8V mode
DPI2 in 3.3V mode		 6.06(3) ns
DPI1/3 in 3.3V mode 13.33(3) ns
D2 tw(clkL) Pulse duration, output pixel clock vouti_clk low P*0.5-1 (1) ns
D3 tw(clkH) Pulse duration, output pixel clock vouti_clk high P*0.5-1 (1) ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI1 1.51 4.55 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI1 1.51 4.55 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (vin2a_fld0 clock reference) 1.51 4.55 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (vin2a_fld0 clock reference) 1.51 4.55 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (xref_clk2 clock reference) 1.51 4.55 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (xref_clk2 clock reference) 1.51 4.55 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI3 1.51 4.55 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI3 1.51 4.55 ns
  1. P = output vouti_clk period in ns.
  2. All pads/balls configured as vouti_* signals must be programmed to use slow slew rate by setting the corresponding CTRL_CORE_PAD_*[SLEWCONTROL] register field to SLOW (0b1).
  3. SERDES transceivers may be sensitive to the jitter profile of vouti_clk. See Application Note SPRAC62 for additional guidance.

Table 7-16 DPI Video Output i (i = 1..3) MANUAL4 Switching Characteristics (2)

NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
D1 tc(clk) Cycle time, output pixel clock vouti_clk DPI1/2/3 in 1.8V mode DPI2 in 3.3V mode 6.06 (3) ns
DPI1/3 in 3.3V mode 13.33 (3) ns
D2 tw(clkL) Pulse duration, output pixel clock vouti_clk low P*0.5-1 (1) ns
D3 tw(clkH) Pulse duration, output pixel clock vouti_clk high P*0.5-1 (1) ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI1 2.85 5.56 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI1 2.85 5.56 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (vin2a_fld0 clock reference) 2.85 5.56 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (vin2a_fld0 clock reference) 2.85 5.56 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (xref_clk2 clock reference) 2.85 5.56 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (xref_clk2 clock reference) 2.85 5.56 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI3 2.85 5.56 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI3 2.85 5.56 ns
  1. P = output vouti_clk period in ns.
  2. All pads/balls configured as vouti_* signals must be programmed to use slow slew rate by setting the corresponding CTRL_CORE_PAD_*[SLEWCONTROL] register field to SLOW (0b1).
  3. SERDES transceivers may be sensitive to the jitter profile of vouti_clk.  See Application Note SPRAC62 for additional guidance.

Table 7-17 DPI Video Output i (i = 1..3) MANUAL5 Switching Characteristics (2)

NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
D1 tc(clk) Cycle time, output pixel clock vouti_clk DPI1/2/3 in 1.8V mode DPI2 in 3.3V mode 6.06 (3) ns
DPI1/3 in 3.3V mode 13.33 (3) ns
D2 tw(clkL) Pulse duration, output pixel clock vouti_clk low P*0.5-1 (1) ns
D3 tw(clkH) Pulse duration, output pixel clock vouti_clk high P*0.5-1 (1) ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI1 3.55 6.61 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI1 3.55 6.61 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (vin2a_fld0 clock reference) 3.55 6.61 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (vin2a_fld0 clock reference) 3.55 6.61 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI2 (xref_clk2 clock reference) 3.55 6.61 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI2 (xref_clk2 clock reference) 3.55 6.61 ns
D5 td(clk-ctlV) Delay time, output pixel clock vouti_clk transition to output data vouti_d[23:0] valid DPI3 3.55 6.61 ns
D6 td(clk-dV) Delay time, output pixel clock vouti_clk transition to output control signals vouti_vsync, vouti_hsync, vouti_de, and vouti_fld valid DPI3 3.55 6.61 ns
  1. P = output vouti_clk period in ns.
  2. All pads/balls configured as vouti_* signals must be programmed to use slow slew rate by setting the corresponding CTRL_CORE_PAD_*[SLEWCONTROL] register field to SLOW (0b1).
  3. SERDES transceivers may be sensitive to the jitter profile of vouti_clk.  See Application Note SPRAC62 for additional guidance.
TDA2EG SPRS906_TIMING_DSS_01.gifFigure 7-6 DPI Video Output(1)(2)(3)
  1. The configuration of assertion of the data can be programmed on the falling or rising edge of the pixel clock.
  2. The polarity and the pulse width of vouti_hsync and vouti_vsync are programmable, refer to the DSS section of the device TRM.
  3. The vouti_clk frequency can be configured, refer to the DSS section of the device TRM.

In Table 7-18 are presented the specific groupings of signals (IOSET) for use with VOUT2.

Table 7-18 VOUT2 IOSETs

SIGNALS IOSET1 IOSET2
BALL MUX BALL MUX
vout2_d23 F2 4 AA4 6
vout2_d22 F3 4 AB3 6
vout2_d21 D1 4 AB9 6
vout2_d20 E2 4 AA3 6
vout2_d19 D2 4 D17 6
vout2_d18 F4 4 G16 6
vout2_d17 C1 4 A21 6
vout2_d16 E4 4 C18 6
vout2_d15 F5 4 A17 6
vout2_d14 E6 4 B17 6
vout2_d13 D3 4 B16 6
vout2_d12 F6 4 D15 6
vout2_d11 D5 4 A15 6
vout2_d10 C2 4 B15 6
vout2_d9 C3 4 A20 6
vout2_d8 C4 4 E15 6
vout2_d7 B2 4 D12 6
vout2_d6 D6 4 C12 6
vout2_d5 C5 4 F13 6
vout2_d4 A3 4 E12 6
vout2_d3 B3 4 J11 6
vout2_d2 B4 4 G13 6
vout2_d1 B5 4 J14 6
vout2_d0 A4 4 B14 6
vout2_vsync G6 4 F20 6
vout2_hsync G1 4 E21 6
vout2_clk H7 4 B26 6
vout2_fld E1 4 F21 6
vout2_de G2 4 C23 6

NOTE

To configure the desired virtual mode the user must set MODESELECT bit and DELAYMODE bit field for each corresponding pad control register.

The pad control registers are presented in Table 4-3 and described in Device TRM, Control Module Chapter.

Virtual IO Timings Modes must be used to ensure some IO timings for VOUT1. See Table 7-2Modes Summary for a list of IO timings requiring the use of Virtual IO Timings Modes. See Table 7-19Virtual Functions Mapping for VOUT1 for a definition of the Virtual modes.

Table 7-19 presents the values for DELAYMODE bit field.

Table 7-19 Virtual Functions Mapping for DSS VOUT1

BALL BALL NAME Delay Mode Value MUXMODE
DSS_VIRTUAL1 0 3
H3 gpmc_ad15 14 vout3_d15
D9 vout1_d9 15 vout1_d9
N7 gpmc_a8 15 vout3_hsync
L6 gpmc_ad4 14 vout3_d4
E8 vout1_d8 15 vout1_d8
M6 gpmc_ad0 14 vout3_d0
F9 vout1_d5 15 vout1_d5
J3 gpmc_ad13 14 vout3_d13
T6 gpmc_a2 15 vout3_d18
M2 gpmc_ad1 14 vout3_d1
P6 gpmc_a4 15 vout3_d20
B10 vout1_de 15 vout1_de
B7 vout1_d16 15 vout1_d16
R5 gpmc_a6 15 vout3_d22
A9 vout1_d21 15 vout1_d21
H2 gpmc_ad14 14 vout3_d14
T9 gpmc_a1 15 vout3_d17
E7 vout1_d7 15 vout1_d7
C11 vout1_hsync 15 vout1_hsync
D11 vout1_clk 15 vout1_clk
P1 gpmc_cs3 15 vout3_clk
B9 vout1_d22 15 vout1_d22
G11 vout1_d3 15 vout1_d3
R4 gpmc_a9 15 vout3_vsync
D8 vout1_d11 15 vout1_d11
J2 gpmc_ad11 14 vout3_d11
L3 gpmc_ad6 14 vout3_d6
D7 vout1_d10 15 vout1_d10
L5 gpmc_ad2 14 vout3_d2
F10 vout1_d2 15 vout1_d2
M1 gpmc_ad3 14 vout3_d3
P5 gpmc_a7 15 vout3_d23
T7 gpmc_a3 15 vout3_d19
A7 vout1_d18 15 vout1_d18
C7 vout1_d15 15 vout1_d15
J1 gpmc_ad10 14 vout3_d10
L2 gpmc_ad7 14 vout3_d7
N9 gpmc_a10 15 vout3_de
F11 vout1_d0 15 vout1_d0
G10 vout1_d1 15 vout1_d1
R9 gpmc_a5 15 vout3_d21
L1 gpmc_ad8 14 vout3_d8
F8 vout1_d6 15 vout1_d6
L4 gpmc_ad5 14 vout3_d5
A10 vout1_d23 15 vout1_d23
E11 vout1_vsync 15 vout1_vsync
C9 vout1_d20 15 vout1_d20
R6 gpmc_a0 15 vout3_d16
A8 vout1_d19 15 vout1_d19
E9 vout1_d4 15 vout1_d4
H1 gpmc_ad12 14 vout3_d12
B11 vout1_fld 15 vout1_fld
P9 gpmc_a11 15 vout3_fld
K2 gpmc_ad9 14 vout3_d9
C6 vout1_d13 15 vout1_d13
B8 vout1_d17 15 vout1_d17
A5 vout1_d12 15 vout1_d12
C8 vout1_d14 15 vout1_d14

NOTE

To configure the desired Manual IO Timing Mode the user must follow the steps described in section "Manual IO Timing Modes" in the device TRM.

The associated registers to configure are listed in the CFG REGISTER column. For more information, see Control Module chapter in the device TRM.

Manual IO Timings Modes must be used to ensure some IO timings for VOUT1. See Table 7-2Modes Summary for a list of IO timings requiring the use of Manual IO Timings Modes. See Table 7-20Manual Functions Mapping for DSS VOUT1 for a definition of the Manual modes.

Table 7-20 lists the A_DELAY and G_DELAY values needed to calculate the correct values to be set in the CFG_x registers.

Table 7-20 Manual Functions Mapping for DSS VOUT1

BALL BALL NAME VOUT1_MANUAL1 VOUT1_MANUAL4 VOUT1_MANUAL5 CFG REGISTER MUXMODE
A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) 0
D11 vout1_clk 0 212 0 249 0 249 CFG_VOUT1_CLK_OUT vout1_clk
F11 vout1_d0 2502 0 3778 0 4648 0 CFG_VOUT1_D0_OUT vout1_d0
G10 vout1_d1 2402 0 3650 0 4520 0 CFG_VOUT1_D1_OUT vout1_d1
D7 vout1_d10 2147 0 3353 0 4223 0 CFG_VOUT1_D10_OUT vout1_d10
D8 vout1_d11 2249 0 3588 0 4458 0 CFG_VOUT1_D11_OUT vout1_d11
A5 vout1_d12 2410 0 3733 0 4603 0 CFG_VOUT1_D12_OUT vout1_d12
C6 vout1_d13 2129 0 3427 0 4297 0 CFG_VOUT1_D13_OUT vout1_d13
C8 vout1_d14 2279 0 3485 0 4355 0 CFG_VOUT1_D14_OUT vout1_d14
C7 vout1_d15 2266 23 3573 0 4443 0 CFG_VOUT1_D15_OUT vout1_d15
B7 vout1_d16 1798 0 3069 0 3939 0 CFG_VOUT1_D16_OUT vout1_d16
B8 vout1_d17 2243 0 3492 0 4362 0 CFG_VOUT1_D17_OUT vout1_d17
A7 vout1_d18 2127 0 3319 0 4189 0 CFG_VOUT1_D18_OUT vout1_d18
A8 vout1_d19 2096 0 3455 0 4225 0 CFG_VOUT1_D19_OUT vout1_d19
F10 vout1_d2 2375 0 3788 0 4658 0 CFG_VOUT1_D2_OUT vout1_d2
C9 vout1_d20 2105 0 3402 0 4272 0 CFG_VOUT1_D20_OUT vout1_d20
A9 vout1_d21 2120 0 3477 0 4347 0 CFG_VOUT1_D21_OUT vout1_d21
B9 vout1_d22 2013 65 3395 0 4265 0 CFG_VOUT1_D22_OUT vout1_d22
A10 vout1_d23 1887 0 3213 0 3983 0 CFG_VOUT1_D23_OUT vout1_d23
G11 vout1_d3 2429 0 3753 0 4623 0 CFG_VOUT1_D3_OUT vout1_d3
E9 vout1_d4 2639 0 3728 0 4598 0 CFG_VOUT1_D4_OUT vout1_d4
F9 vout1_d5 2319 0 3643 0 4363 0 CFG_VOUT1_D5_OUT vout1_d5
F8 vout1_d6 2227 0 3544 0 4264 0 CFG_VOUT1_D6_OUT vout1_d6
E7 vout1_d7 2309 0 3707 0 4427 0 CFG_VOUT1_D7_OUT vout1_d7
E8 vout1_d8 1999 0 3315 0 4185 0 CFG_VOUT1_D8_OUT vout1_d8
D9 vout1_d9 2276 0 3539 0 4409 0 CFG_VOUT1_D9_OUT vout1_d9
B10 vout1_de 1933 0 3507 0 4177 0 CFG_VOUT1_DE_OUT vout1_de
B11 vout1_fld 1825 0 3382 0 4052 0 CFG_VOUT1_FLD_OUT vout1_fld
C11 vout1_hsync 1741 13 3408 0 4278 0 CFG_VOUT1_HSYNC_OUT vout1_hsync
E11 vout1_vsync 2338 0 3718 0 4588 0 CFG_VOUT1_VSYNC_OUT vout1_vsync

Manual IO Timings Modes must be used to ensure some IO timings for VOUT2. See Table 7-2Modes Summary for a list of IO timings requiring the use of Manual IO Timings Modes. See Table 7-21Manual Functions Mapping for DSS VOUT2 IOSET1 for a definition of the Manual modes.

Table 7-21 lists the A_DELAY and G_DELAY values needed to calculate the correct values to be set in the CFG_x registers.

Table 7-21 Manual Functions Mapping for DSS VOUT2 IOSET1

BALL BALL NAME VOUT2_IOSET1_
MANUAL1		 VOUT2_IOSET1_
MANUAL2		 VOUT2_IOSET1_
MANUAL3		 VOUT2_IOSET1_
MANUAL4		 VOUT2_IOSET1_
MANUAL5		 CFG REGISTER MUXMODE
A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) 4
E1 vin2a_clk0 2571 0 1059 0 1025 0 4110 0 4980 0 CFG_VIN2A_CLK0_OUT vout2_fld
F2 vin2a_d0 2124 0 589 0 577 0 3613 0 4483 0 CFG_VIN2A_D0_OUT vout2_d23
F3 vin2a_d1 2103 0 568 0 557 0 3442 0 4312 0 CFG_VIN2A_D1_OUT vout2_d22
D3 vin2a_d10 2091 0 557 0 545 0 3430 0 4200 0 CFG_VIN2A_D10_OUT vout2_d13
F6 vin2a_d11 2142 0 608 0 596 0 3481 0 4251 0 CFG_VIN2A_D11_OUT vout2_d12
D5 vin2a_d12 2920 385 1816 255 1783 276 3943 601 4713 601 CFG_VIN2A_D12_OUT vout2_d11
C2 vin2a_d13 2776 322 1872 192 1838 213 3799 538 4669 538 CFG_VIN2A_D13_OUT vout2_d10
C3 vin2a_d14 2904 0 1769 0 1757 0 3869 174 4739 174 CFG_VIN2A_D14_OUT vout2_d9
C4 vin2a_d15 2670 257 1665 127 1632 148 3792 473 4662 473 CFG_VIN2A_D15_OUT vout2_d8
B2 vin2a_d16 2814 155 1908 31 1878 43 3837 371 4707 371 CFG_VIN2A_D16_OUT vout2_d7
D6 vin2a_d17 3002 199 1897 69 1865 89 4024 415 4894 415 CFG_VIN2A_D17_OUT vout2_d6
C5 vin2a_d18 1893 0 358 0 347 0 3432 0 4302 0 CFG_VIN2A_D18_OUT vout2_d5
A3 vin2a_d19 1698 0 163 0 151 0 3237 0 4007 0 CFG_VIN2A_D19_OUT vout2_d4
D1 vin2a_d2 2193 0 658 0 646 0 3531 0 4401 0 CFG_VIN2A_D2_OUT vout2_d21
B3 vin2a_d20 1736 0 202 0 190 0 3075 0 3945 0 CFG_VIN2A_D20_OUT vout2_d3
B4 vin2a_d21 1636 0 101 0 89 0 3074 0 3944 0 CFG_VIN2A_D21_OUT vout2_d2
B5 vin2a_d22 1628 0 93 0 81 0 3266 0 4036 0 CFG_VIN2A_D22_OUT vout2_d1
A4 vin2a_d23 1538 0 0 0 0 0 2968 0 3838 0 CFG_VIN2A_D23_OUT vout2_d0
E2 vin2a_d3 1997 0 462 0 450 0 3335 0 4205 0 CFG_VIN2A_D3_OUT vout2_d20
D2 vin2a_d4 2528 0 993 0 982 0 3867 0 4537 0 CFG_VIN2A_D4_OUT vout2_d19
F4 vin2a_d5 2038 0 503 0 492 0 3577 0 4347 0 CFG_VIN2A_D5_OUT vout2_d18
C1 vin2a_d6 1746 0 211 0 200 0 3285 0 4055 0 CFG_VIN2A_D6_OUT vout2_d17
E4 vin2a_d7 2213 0 678 0 666 0 3552 0 4272 0 CFG_VIN2A_D7_OUT vout2_d16
F5 vin2a_d8 2268 0 733 0 721 0 3607 0 4277 0 CFG_VIN2A_D8_OUT vout2_d15
E6 vin2a_d9 2170 0 635 0 623 0 3509 0 4379 0 CFG_VIN2A_D9_OUT vout2_d14
G2 vin2a_de0 2102 0 568 0 556 0 3841 0 4611 0 CFG_VIN2A_DE0_OUT vout2_de
H7 vin2a_fld0 0 983 1398 1185 1385 1202 0 994 0 994 CFG_VIN2A_FLD0_OUT vout2_clk
G1 vin2a_hsync0 2482 0 974 0 936 0 4021 0 4891 0 CFG_VIN2A_HSYNC0_OUT vout2_hsync
G6 vin2a_vsync0 2296 0 784 0 750 0 3935 0 4805 0 CFG_VIN2A_VSYNC0_OUT vout2_vsync

Manual IO Timings Modes must be used to ensure some IO timings for VOUT2. See Table 7-2Modes Summary for a list of IO timings requiring the use of Manual IO Timings Modes. See Table 7-22Manual Functions Mapping for DSS VOUT2 IOSET2 for a definition of the Manual modes.

Table 7-22 lists the A_DELAY and G_DELAY values needed to calculate the correct values to be set in the CFG_x registers.

Table 7-22 Manual Functions Mapping for DSS VOUT2 IOSET2

BALL BALL NAME VOUT2_IOSET2_
MANUAL1		 VOUT2_IOSET2_
MANUAL2		 VOUT2_IOSET2_
MANUAL3		 VOUT2_IOSET2_
MANUAL4		 VOUT2_IOSET2_
MANUAL5		 CFG REGISTER MUXMODE
A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) 6
E21 gpio6_14 1983 0 79 0 68 0 3513 0 4383 0 CFG_GPIO6_14_OUT vout2_hsync
F20 gpio6_15 2159 0 158 0 148 0 3689 0 4559 0 CFG_GPIO6_15_OUT vout2_vsync
F21 gpio6_16 1864 0 0 0 0 0 3394 0 4264 0 CFG_GPIO6_16_OUT vout2_fld
B14 mcasp1_aclkr 2614 0 1255 0 1270 0 4353 0 5223 0 CFG_MCASP1_ACLKR_OUT vout2_d0
G13 mcasp1_axr2 2705 0 1350 0 1360 0 4444 0 5314 0 CFG_MCASP1_AXR2_OUT vout2_d2
J11 mcasp1_axr3 2865 0 1210 0 1219 0 4504 0 5374 0 CFG_MCASP1_AXR3_OUT vout2_d3
E12 mcasp1_axr4 2759 0 1404 0 1413 0 4498 0 5368 0 CFG_MCASP1_AXR4_OUT vout2_d4
F13 mcasp1_axr5 2980 0 1325 0 1335 0 4419 0 5289 0 CFG_MCASP1_AXR5_OUT vout2_d5
C12 mcasp1_axr6 2634 0 1275 0 1289 0 4373 0 5243 0 CFG_MCASP1_AXR6_OUT vout2_d6
D12 mcasp1_axr7 2658 0 1302 0 1311 0 4396 0 5266 0 CFG_MCASP1_AXR7_OUT vout2_d7
J14 mcasp1_fsr 2818 0 1163 0 1172 0 4456 0 5326 0 CFG_MCASP1_FSR_OUT vout2_d1
E15 mcasp2_aclkr 2728 0 1373 0 1382 0 4367 0 5237 0 CFG_MCASP2_ACLKR_OUT vout2_d8
B15 mcasp2_axr0 2513 0 319 534 308 560 4151 0 5021 0 CFG_MCASP2_AXR0_OUT vout2_d10
A15 mcasp2_axr1 2712 0 1357 0 1366 0 4351 0 5221 0 CFG_MCASP2_AXR1_OUT vout2_d11
D15 mcasp2_axr4 2529 0 1169 0 1184 0 4267 0 5137 0 CFG_MCASP2_AXR4_OUT vout2_d12
B16 mcasp2_axr5 2376 0 543 478 1029 0 4114 0 4984 0 CFG_MCASP2_AXR5_OUT vout2_d13
B17 mcasp2_axr6 2620 0 1265 0 1274 0 4359 0 5229 0 CFG_MCASP2_AXR6_OUT vout2_d14
A17 mcasp2_axr7 2492 0 354 483 845 0 4130 0 5000 0 CFG_MCASP2_AXR7_OUT vout2_d15
A20 mcasp2_fsr 2358 0 12 487 513 0 3797 0 4667 0 CFG_MCASP2_FSR_OUT vout2_d9
C18 mcasp4_aclkx 2524 0 1165 0 1179 0 3863 0 4733 0 CFG_MCASP4_ACLKX_OUT vout2_d16
G16 mcasp4_axr0 2578 0 797 0 806 0 4208 0 5078 0 CFG_MCASP4_AXR0_OUT vout2_d18
D17 mcasp4_axr1 2253 0 750 0 759 0 3983 0 4853 0 CFG_MCASP4_AXR1_OUT vout2_d19
A21 mcasp4_fsx 2478 0 823 0 832 0 4117 0 4987 0 CFG_MCASP4_FSX_OUT vout2_d17
AA3 mcasp5_aclkx 4672 1737 3256 1798 3226 1837 5900 1949 6770 1949 CFG_MCASP5_ACLKX_OUT vout2_d20
AB3 mcasp5_axr0 4642 1286 3226 1347 3196 1386 5870 1497 6740 1497 CFG_MCASP5_AXR0_OUT vout2_d22
AA4 mcasp5_axr1 4625 725 3209 786 3179 825 6153 935 7023 935 CFG_MCASP5_AXR1_OUT vout2_d23
AB9 mcasp5_fsx 4565 1062 3149 1123 3119 1162 6093 1273 6963 1273 CFG_MCASP5_FSX_OUT vout2_d21
B26 xref_clk2 0 49 1359 466 1341 512 0 60 0 60 CFG_XREF_CLK2_OUT vout2_clk
C23 xref_clk3 1947 0 36 0 45 0 3378 0 4248 0 CFG_XREF_CLK3_OUT vout2_de

Manual IO Timings Modes must be used to ensure some IO timings for VOUT3. See Table 7-2Modes Summary for a list of IO timings requiring the use of Manual IO Timings Modes. See Table 7-23Manual Functions Mapping for DSS VOUT3 for a definition of the Manual modes.

Table 7-23 lists the A_DELAY and G_DELAY values needed to calculate the correct values to be set in the CFG_x registers.

Table 7-23 Manual Functions Mapping for DSS VOUT3

BALL BALL NAME VOUT3_MANUAL1 VOUT3_MANUAL4 VOUT3_MANUAL5 CFG REGISTER MUXMODE
A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) A_DELAY (ps) G_DELAY (ps) 3
R6 gpmc_a0 2395 0 3909 0 4779 0 CFG_GPMC_A0_OUT vout3_d16
T9 gpmc_a1 2412 0 3957 0 4827 0 CFG_GPMC_A1_OUT vout3_d17
N9 gpmc_a10 2473 0 3980 0 4850 0 CFG_GPMC_A10_OUT vout3_de
P9 gpmc_a11 2906 0 4253 0 5123 0 CFG_GPMC_A11_OUT vout3_fld
T6 gpmc_a2 2360 0 3873 0 4743 0 CFG_GPMC_A2_OUT vout3_d18
T7 gpmc_a3 2391 0 4112 0 4982 0 CFG_GPMC_A3_OUT vout3_d19
P6 gpmc_a4 2626 0 4336 0 5206 0 CFG_GPMC_A4_OUT vout3_d20
R9 gpmc_a5 2338 0 3840 0 4710 0 CFG_GPMC_A5_OUT vout3_d21
R5 gpmc_a6 2374 0 3913 0 4783 0 CFG_GPMC_A6_OUT vout3_d22
P5 gpmc_a7 2432 0 3947 0 4817 0 CFG_GPMC_A7_OUT vout3_d23
N7 gpmc_a8 3155 0 4309 105 5179 105 CFG_GPMC_A8_OUT vout3_hsync
R4 gpmc_a9 2309 0 3842 0 4712 0 CFG_GPMC_A9_OUT vout3_vsync
M6 gpmc_ad0 2360 0 3652 0 4522 0 CFG_GPMC_AD0_OUT vout3_d0
M2 gpmc_ad1 2420 0 3762 0 4632 0 CFG_GPMC_AD1_OUT vout3_d1
J1 gpmc_ad10 2235 0 3456 0 4326 0 CFG_GPMC_AD10_OUT vout3_d10
J2 gpmc_ad11 2253 0 3584 0 4454 0 CFG_GPMC_AD11_OUT vout3_d11
H1 gpmc_ad12 1949 427 3589 0 4459 0 CFG_GPMC_AD12_OUT vout3_d12
J3 gpmc_ad13 2318 0 3547 0 4417 0 CFG_GPMC_AD13_OUT vout3_d13
H2 gpmc_ad14 2123 0 3302 0 4172 0 CFG_GPMC_AD14_OUT vout3_d14
H3 gpmc_ad15 2195 29 3532 0 4402 0 CFG_GPMC_AD15_OUT vout3_d15
L5 gpmc_ad2 2617 0 3859 0 4729 0 CFG_GPMC_AD2_OUT vout3_d2
M1 gpmc_ad3 2350 0 3590 0 4460 0 CFG_GPMC_AD3_OUT vout3_d3
L6 gpmc_ad4 2324 0 3534 0 4404 0 CFG_GPMC_AD4_OUT vout3_d4
L4 gpmc_ad5 2371 0 3609 0 4479 0 CFG_GPMC_AD5_OUT vout3_d5
L3 gpmc_ad6 2231 0 3416 0 4286 0 CFG_GPMC_AD6_OUT vout3_d6
L2 gpmc_ad7 2440 0 3661 0 4531 0 CFG_GPMC_AD7_OUT vout3_d7
L1 gpmc_ad8 2479 0 3714 0 4584 0 CFG_GPMC_AD8_OUT vout3_d8
K2 gpmc_ad9 2355 0 3593 0 4463 0 CFG_GPMC_AD9_OUT vout3_d9
P1 gpmc_cs3 0 641 0 905 0 905 CFG_GPMC_CS3_OUT vout3_clk