The THS413x device was designed to be operated on power supplies ranging from 2.5V to 15V. Single power supplies ranging from 5V to 30V can also be used. TI recommends using power-supply accuracy of 5%, or better. When operated on a board with high-speed digital signals, it is important to provide isolation between digital signal noise and the analog input pins. The THS413x is connected to power supplies through pin 3 (VCC+) and pin 6 (VCC-). Each supply pin should be decoupled to GND as close to the device as possible with a low-inductance, surface-mount ceramic capacitor of approximately 10 nF. When vias are used to connect the bypass capacitors to a ground plane the vias should be configured for minimal parasitic inductance. One method of reducing via inductance is to use multiple vias. For broadband systems, two capacitors per supply pin are advised.
To avoid undesirable signal transients, the THS413x device should not be powered on with large inputs signals present. Careful planning of system power on sequencing is especially important to avoid damage to ADC inputs when an ADC is used in the application.