SCPS268 September   2017 TIC10024-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source/Sink Selection
        2. 8.3.8.2 Input Enable Selection
        3. 8.3.8.3 Thresholds Adjustment
        4. 8.3.8.4 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable / Disable And Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check And Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
  9. Programming
    1. 9.1 SPI Communication Interface Buses
      1. 9.1.1 Chip Select (CS)
      2. 9.1.2 System Clock (SCLK)
      3. 9.1.3 Slave In (SI)
      4. 9.1.4 Slave Out (SO)
    2. 9.2 SPI Sequence
      1. 9.2.1 Read Operation
      2. 9.2.2 Write Operation
      3. 9.2.3 Status Flag
    3. 9.3 Programming Guidelines
    4. 9.4 Register_Maps
      1. 9.4.1  DEVICE_ID register (Offset = 1h) [reset = 20h]
      2. 9.4.2  INT_STAT Register (Offset = 2h) [reset = 1h]
      3. 9.4.3  CRC Register (Offset = 3h) [reset = FFFFh]
      4. 9.4.4  IN_STAT_MISC Register (Offset = 4h) [reset = 0h]
      5. 9.4.5  IN_STAT_COMP Register (Offset = 5h) [reset = 0h]
      6. 9.4.6  CONFIG Register (Offset = 1Ah) [reset = 0h]
      7. 9.4.7  IN_EN Register (Offset = 1Bh) [reset = 0h]
      8. 9.4.8  CS_SELECT Register (Offset = 1Ch) [reset = 0h]
      9. 9.4.9  WC_CFG0 Register (Offset = 1Dh) [reset = 0h]
      10. 9.4.10 WC_CFG1 Register (Offset = 1Eh) [reset = 0h]
      11. 9.4.11 CCP_CFG0 Register (Offset = 1Fh) [reset = 0h]
      12. 9.4.12 CCP_CFG1 Register (Offset = 20h) [reset = 0h]
      13. 9.4.13 THRES_COMP Register (Offset = 21h) [reset = 0h]
      14. 9.4.14 INT_EN_COMP1 Register (Offset = 22h) [reset = 0h]
      15. 9.4.15 INT_EN_COMP2 Register (Offset = 23h) [reset = 0h]
      16. 9.4.16 INT_EN_CFG0 Register (Offset = 24h) [reset = 0h]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Switch Detection in Automotive Body Control Module
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Systems Examples
      1. 10.3.1 Using TIC10024-Q1 in a 12 V Automotive System
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C4B
  • Designed to Support 12-V Automotive Systems with Over-voltage and Under-voltage Warning
  • Monitors up to 24 Direct Switch Inputs with 10 Inputs Configurable to Monitor Switches Connected to Either Ground or Battery
  • Switch Input Withstands up to 40 V (Load Dump Condition) and down to –24 V (Reverse Polarity Condition)
  • 6 Configurable Wetting Current Settings:
    (0 mA, 1 mA, 2 mA, 5 mA, 10 mA, and 15 mA)
  • Integrated Comparator with 4 Programmable Thresholds for Digital Switch Monitoring
  • Ultra-low Operating Current in Polling Mode:
    68 μA Typical (tPOLL = 64 ms, tPOLL_ACT = 128 μs,
    All 24 Inputs Active, Comparator Mode, All Switches Open)
  • Interfaces Directly to MCU Using 3.3 V / 5 V Serial Peripheral Interface (SPI) Protocol
  • Interrupt Generation to Support Wake-Up Operation on All Inputs
  • ±8 kV Contact Discharge ESD Protection on Input Pins per ISO-10605 With Appropriate External Components
  • 38-Pin TSSOP Package

Applications

  • Body Control Module and Gateway
  • Automotive Lighting
  • Heating and Cooling
  • Power Seats
  • Mirrors

Description

The TIC10024-Q1 is an advanced Multiple Switch Detection Interface (MSDI) device designed to detect external switch status in a 12-V automotive system. The TIC10024-Q1 features a comparator with adjustable thresholds to monitor digital switches independently of the MCU. The device monitors 24 direct switch inputs, with 10 inputs configurable to monitor switches connected to either ground or battery. 6 unique wetting current settings can be programmed for each input to support different application scenarios. The device supports wake-up operation on all switch inputs to eliminate the need to keep the MCU active continuously, thus reducing power consumption of the system. The TIC10024-Q1 also offers integrated fault detection and ESD protection for improved system robustness. The TIC10024-Q1 supports 2 modes of operations: continuous and polling mode. In continuous mode, wetting current is supplied continuously. In polling mode, wetting current is turned on periodically to sample the input status based on a programmable timer, thus the system power consumption is significantly reduced.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TIC10024-Q1 TSSOP (38) 9.70 mm x 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

TIC10024-Q1 schem-01-scps260.gif