SCPS269 September   2017 TIC12400

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7  Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch inputs Settings
        1. 8.3.8.1 Input Current Source/Sink Selection
        2. 8.3.8.2 Input Mode Selection
        3. 8.3.8.3 Input Enable Selection
        4. 8.3.8.4 Thresholds Adjustment
        5. 8.3.8.5 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable/disable And Interrupt generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check And Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
        1. 8.4.2.1 Standard Polling
        2. 8.4.2.2 Matrix Polling
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
        3. 8.4.3.3 VS Measurement
        4. 8.4.3.4 Wetting Current Diagnostic
        5. 8.4.3.5 ADC Self-Diagnostic
    5. 8.5 Programming
      1. 8.5.1 SPI Communication Interface Buses
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 System Clock (SCLK)
        3. 8.5.1.3 Slave In (SI)
        4. 8.5.1.4 Slave Out (SO)
      2. 8.5.2 SPI Sequence
        1. 8.5.2.1 Read Operation
        2. 8.5.2.2 Write Operation
        3. 8.5.2.3 Status Flag
    6. 8.6 Register Maps
      1. 8.6.1  DEVICE_ID register (Offset = 1h) [reset = 20h]
      2. 8.6.2  INT_STAT Register (Offset = 2h) [reset = 1h]
      3. 8.6.3  CRC Register (Offset = 3h) [reset = FFFFh]
      4. 8.6.4  IN_STAT_MISC Register (Offset = 4h) [reset = 0h]
      5. 8.6.5  IN_STAT_COMP Register (Offset = 5h) [reset = 0h]
      6. 8.6.6  IN_STAT_ADC0 Register (Offset = 6h) [reset = 0h]
      7. 8.6.7  IN_STAT_ADC1 Register (Offset = 7h) [reset = 0h]
      8. 8.6.8  IN_STAT_MATRIX0 Register (Offset = 8h) [reset = 0h]
      9. 8.6.9  IN_STAT_MATRIX1 Register (Offset = 9h) [reset = 0h]
      10. 8.6.10 ANA_STAT0 Register (Offset = Ah) [reset = 0h]
      11. 8.6.11 ANA_STAT1 Register (Offset = Bh) [reset = 0h]
      12. 8.6.12 ANA_STAT2 Register (Offset = Ch) [reset = 0h]
      13. 8.6.13 ANA_STAT3 Register (Offset = Dh) [reset = 0h]
      14. 8.6.14 ANA_STAT4 Register (Offset = Eh) [reset = 0h]
      15. 8.6.15 ANA_STAT5 Register (Offset = Fh) [reset = 0h]
      16. 8.6.16 ANA_STAT6 Register (Offset = 10h) [reset = 0h]
      17. 8.6.17 ANA_STAT7 Register (Offset = 11h) [reset = 0h]
      18. 8.6.18 ANA_STAT8 Register (Offset = 12h) [reset = 0h]
      19. 8.6.19 ANA_STAT9 Register (Offset = 13h) [reset = 0h]
      20. 8.6.20 ANA_STAT10 Register (Offset = 14h) [reset = 0h]
      21. 8.6.21 ANA_STAT11 Register (Offset = 15h) [reset = 0h]
      22. 8.6.22 ANA_STAT12 Register (Offset = 16h) [reset = 0h]
      23. 8.6.23 CONFIG Register (Offset = 1Ah) [reset = 0h]
      24. 8.6.24 IN_EN Register (Offset = 1Bh) [reset = 0h]
      25. 8.6.25 CS_SELECT Register (Offset = 1Ch) [reset = 0h]
      26. 8.6.26 WC_CFG0 Register (Offset = 1Dh) [reset = 0h]
      27. 8.6.27 WC_CFG1 Register (Offset = 1Eh) [reset = 0h]
      28. 8.6.28 CCP_CFG0 Register (Offset = 1Fh) [reset = 0h]
      29. 8.6.29 CCP_CFG1 Register (Offset = 20h) [reset = 0h]
      30. 8.6.30 THRES_COMP Register (Offset = 21h) [reset = 0h]
      31. 8.6.31 INT_EN_COMP1 Register (Offset = 22h) [reset = 0h]
      32. 8.6.32 INT_EN_COMP2 Register (Offset = 23h) [reset = 0h]
      33. 8.6.33 INT_EN_CFG0 Register (Offset = 24h) [reset = 0h]
      34. 8.6.34 INT_EN_CFG1 Register (Offset = 25h) [reset = 0h]
      35. 8.6.35 INT_EN_CFG2 Register (Offset = 26h) [reset = 0h]
      36. 8.6.36 INT_EN_CFG3 Register (Offset = 27h) [reset = 0h]
      37. 8.6.37 INT_EN_CFG4 Register (Offset = 28h) [reset = 0h]
      38. 8.6.38 THRES_CFG0 Register (Offset = 29h) [reset = 0h]
      39. 8.6.39 THRES_CFG1 Register (Offset = 2Ah) [reset = 0h]
      40. 8.6.40 THRES_CFG2 Register (Offset = 2Bh) [reset = 0h]
      41. 8.6.41 THRES_CFG3 Register (Offset = 2Ch) [reset = X]
      42. 8.6.42 THRES_CFG4 Register (Offset = 2Dh) [reset = X]
      43. 8.6.43 THRESMAP_CFG0 Register (Offset = 2Eh) [reset = 0h]
      44. 8.6.44 THRESMAP_CFG1 Register (Offset = 2Fh) [reset = 0h]
      45. 8.6.45 THRESMAP_CFG2 Register (Offset = 30h) [reset = 0h]
      46. 8.6.46 Matrix Register (Offset = 31h) [reset = 0h]
      47. 8.6.47 Mode Register (Offset = 32h) [reset = 0h]
    7. 8.7 Programming Guidelines
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Digital IO Switches and Analog Voltage Monitoring
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.