SBOS753B June   2016  – February 2017 TLV2313 , TLV313 , TLV4313

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TLV313
    5. 7.5  Thermal Information: TLV2313
    6. 7.6  Thermal Information: TLV4313
    7. 7.7  Electrical Characteristics: 5.5 V
    8. 7.8  Electrical Characteristics: 1.8 V
    9. 7.9  Typical Characteristics: Table of Graphs
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 EMI Susceptibility and Input Filtering
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

DCK Package
5-Pin SC70
TLV313 Top View
DBV Package
5-Pin SOT23
TLV313 Top View

Pin Functions: TLV313

PIN I/O DESCRIPTION
NAME DCK (SC70) DBV (SOT23)
+IN 1 3 I Noninverting input
–IN 3 4 I Inverting input
OUT 4 1 O Output
V+ 5 5 Positive (highest) power supply
V– 2 2 Negative (lowest) power supply
D, DGK Packages
8-Pin SOIC, 8-Pin VSSOP
TLV2313 Top View

Pin Functions: TLV2313

PIN I/O DESCRIPTION
NAME D (SOIC) DGK (VSSOP)
V– 4 4 Negative (lowest) power supply
V+ 8 8 Positive (highest) power supply
OUT A 1 1 O Output, channel A
OUT B 7 7 O Output, channel B
–IN A 2 2 I Inverting input, channel A
+IN A 3 3 I Noninverting input, channel A
–IN B 6 6 I Inverting input, channel B
+IN B 5 5 I Noninverting input, channel B
PW Package
14-Pin TSSOP
TLV4313 Top View

Pin Functions: TLV4313

PIN I/O DESCRIPTION
NAME PW (TSSOP)
V– 11 Negative (lowest) power supply
V+ 4 Positive (highest) power supply
OUT A 1 O Output, channel A
OUT B 7 O Output, channel B
OUT C 8 O Output, channel C
OUT D 14 O Output, channel D
–IN A 2 I Inverting input, channel A
+IN A 3 I Noninverting input, channel A
–IN B 6 I Inverting input, channel B
+IN B 5 I Noninverting input, channel B
–IN C 9 I Inverting input, channel C
+IN C 10 I Noninverting input, channel C
–IN D 13 I Inverting input, channel D
+IN D 12 I Noninverting input, channel D