SLAS671C February   2010  – January 2017 TLV320DAC3100

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics
    6. 4.6  Power Dissipation Ratings
    7. 4.7  I2S, LJF, and RJF Timing in Master Mode
    8. 4.8  I2S, LJF, and RJF Timing in Slave Mode
    9. 4.9  DSP Timing in Master Mode
    10. 4.10 DSP Timing in Slave Mode
    11. 4.11 I2C Interface Timing
    12. 4.12 Typical Characteristics
      1. 4.12.1 DAC Performance
      2. 4.12.2 Class-D Speaker Driver Performance
      3. 4.12.3 Analog Bypass Performance H
      4. 4.12.4 MICBIAS Performance H
  5. 5 Parameter Measurement Information
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Supply Sequence
      2. 6.3.2  Reset
      3. 6.3.3  Device Start-Up Lockout Times
      4. 6.3.4  PLL Start-Up
      5. 6.3.5  Power-Stage Reset
      6. 6.3.6  Software Power Down
      7. 6.3.7  Audio Analog I/O
      8. 6.3.8  Digital Processing Low-Power Modes
        1. 6.3.8.1 DAC Playback on Headphones, Stereo, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
        2. 6.3.8.2 DAC Playback on Headphones, Mono, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
        3. 6.3.8.3 DAC Playback on Headphones, Stereo, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
        4. 6.3.8.4 DAC Playback on Headphones, Mono, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
        5. 6.3.8.5 DAC Playback on Headphones, Stereo, 192 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
        6. 6.3.8.6 DAC Playback on Line Out (10 k-Ω load), Stereo, 48 kHz, DVDD = 1.8 V, AVDD = 3 V, HPVDD = 3 V
      9. 6.3.9  Analog Signals
        1. 6.3.9.1 MICBIAS
        2. 6.3.9.2 Analog Inputs AIN1 and AIN2
      10. 6.3.10 Audio DAC and Audio Analog Outputs
        1. 6.3.10.1  DAC
          1. 6.3.10.1.1 DAC Processing Blocks
          2. 6.3.10.1.2 DAC Processing Blocks — Details
            1. 6.3.10.1.2.1  Three Biquads, Filter A
            2. 6.3.10.1.2.2  Six Biquads, First-Order IIR, DRC, Filter A or B
            3. 6.3.10.1.2.3  Six Biquads, First-Order IIR, Filter A or B
            4. 6.3.10.1.2.4  IIR, Filter B or C
            5. 6.3.10.1.2.5  Four Biquads, DRC, Filter B
            6. 6.3.10.1.2.6  Four Biquads, Filter B
            7. 6.3.10.1.2.7  Four Biquads, First-Order IIR, DRC, Filter C
            8. 6.3.10.1.2.8  Four Biquads, First-Order IIR, Filter C
            9. 6.3.10.1.2.9  Two Biquads, 3D, Filter A
            10. 6.3.10.1.2.10 Five Biquads, DRC, 3D, Filter A
            11. 6.3.10.1.2.11 Five Biquads, DRC, 3D, Beep Generator, Filter A
          3. 6.3.10.1.3 DAC User-Programmable Filters
            1. 6.3.10.1.3.1 First-Order IIR Section
            2. 6.3.10.1.3.2 Biquad Section
          4. 6.3.10.1.4 DAC Interpolation Filter Characteristics
            1. 6.3.10.1.4.1 Interpolation Filter A
            2. 6.3.10.1.4.2 Interpolation Filter B
            3. 6.3.10.1.4.3 Interpolation Filter C
        2. 6.3.10.2  DAC Digital-Volume Control
        3. 6.3.10.3  Volume Control Pin
        4. 6.3.10.4  Dynamic Range Compression
          1. 6.3.10.4.1 DRC Threshold
          2. 6.3.10.4.2 DRC Hysteresis
          3. 6.3.10.4.3 DRC Hold Time
          4. 6.3.10.4.4 DRC Attack Rate
          5. 6.3.10.4.5 DRC Decay Rate
          6. 6.3.10.4.6 Example Setup for DRC
        5. 6.3.10.5  Headphone Detection
        6. 6.3.10.6  Interrupts
        7. 6.3.10.7  Key-Click Functionality With Digital Sine-Wave Generator (PRB_P25)
        8. 6.3.10.8  Programming DAC Digital Filter Coefficients
        9. 6.3.10.9  Updating DAC Digital Filter Coefficients During PLAY
        10. 6.3.10.10 Digital Mixing and Routing
        11. 6.3.10.11 Analog Audio Routing
          1. 6.3.10.11.1 Analog Output Volume Control
          2. 6.3.10.11.2 Headphone Analog-Output Volume Control
          3. 6.3.10.11.3 Class-D Speaker Analog Output Volume Control
        12. 6.3.10.12 Analog Outputs
          1. 6.3.10.12.1 Headphone Drivers
          2. 6.3.10.12.2 Speaker Drivers
        13. 6.3.10.13 Audio-Output Stage-Power Configurations
        14. 6.3.10.14 DAC Setup
        15. 6.3.10.15 Example Register Setup to Play Digital Data Through DAC and Headphone/Speaker Outputs
      11. 6.3.11 CLOCK Generation and PLL
        1. 6.3.11.1 PLL
      12. 6.3.12 Timer
      13. 6.3.13 Digital Audio and Control Interface
        1. 6.3.13.1 Digital Audio Interface
          1. 6.3.13.1.1 Right-Justified Mode
          2. 6.3.13.1.2 Left-Justified Mode
          3. 6.3.13.1.3 I2S Mode
          4. 6.3.13.1.4 DSP Mode
        2. 6.3.13.2 Primary and Secondary Digital Audio Interface Selection
        3. 6.3.13.3 Control Interface
          1. 6.3.13.3.1 I2C Control Mode
    4. 6.4 Register Map
      1. 6.4.1 TLV320DAC3100 Register Map
      2. 6.4.2 Registers
        1. 6.4.2.1 Control Registers, Page 0 (Default Page): Clock Multipliers, Dividers, Serial Interfaces, Flags, Interrupts, and GPIOs
        2. 6.4.2.2 Control Registers, Page 1: DAC, Power-Controls, and MISC Logic-Related Programmability
        3. 6.4.2.3 Control Registers, Page 3: MCLK Divider for Programmable Delay Timer
        4. 6.4.2.4 Control Registers, Page 8: DAC Programmable Coefficients RAM Buffer A (1:63)
        5. 6.4.2.5 Control Registers, Page 9: DAC Programmable Coefficients RAM Buffer A (65:127)
        6. 6.4.2.6 Control Registers, Page 12: DAC Programmable Coefficients RAM Buffer B (1:63)
        7. 6.4.2.7 Control Registers, Page 13: DAC Programmable Coefficients RAM Buffer B (65:127)
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Device Nomenclature
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical Packaging and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Device Support

10.1.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX and TMDX) through fully qualified production devices and tools (TMS and TMDS).

Device development evolutionary flow:

    TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMSProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, your package), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz (for example, your device speed range). provides a legend for reading the complete device name for any your device device.

For orderable part numbers of your device devices in the your package package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the Silicon Errata (literature number SPRZxxx).

10.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.3 Trademarks

E2E is a trademark of Texas Instruments.

MATLAB is a trademark of The MathWorks, Inc.

All other trademarks are the property of their respective owners.

10.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.5 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.