SBVS292C July   2016  – June 2018

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit (Fixed-Voltage Versions)
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN Less Than 2 V
      2. 7.4.2 Operation with VIN Greater Than 2 V
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Requirements
      2. 8.1.2 Transient Response
      3. 8.1.3 Thermal Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitance
        2. 8.2.2.2 Output Capacitance
        3. 8.2.2.3 Thermal Calculation
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    3. 10.3 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Input and Output Capacitor Requirements

Ceramic, 1.0-µF, X5R- and X7R-type capacitors are recommended because these capacitors have minimal variation in value and equivalent series resistance (ESR) over temperature.

However, the TLV700xx-Q1 devices are designed to be stable with an effective capacitance of 0.1 µF or larger at the output. Thus, these devices are stable with capacitors of other dielectric types as well, as long as the effective capacitance under operating bias voltage and temperature is greater than 0.1 µF. This effective capacitance refers to the capacitance under the operating bias voltage and temperature conditions; that is, the capacitance after taking both bias voltage and temperature derating into consideration. In addition to allowing the use of cheaper dielectrics, this capability of being stable with 0.1-µF effective capacitances also enables the use of smaller-footprint capacitors that have higher derating in size- and space-constrained applications.

Note that using a 0.1-µF rated capacitor at the output of the LDO does not ensure stability because the effective capacitance under the specified operating conditions is less than 0.1 µF. Maximum ESR must be less than 200 mΩ.

Although an input capacitor is not required for stability, good analog design practice is to connect a 0.1-µF to
1-µF, low-ESR capacitor across the IN pin and the GND pin of the regulator. This capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast, rise-time load transients are anticipated, or if the device is not located close to the power source. If source impedance is more than 2 Ω, a 0.1-µF input capacitor may be necessary to ensure stability.