SBVS283E August   2016  – July 2019 TLV733P-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      Dropout Voltage vs Output Current
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown and Output Enable
      3. 7.3.3 Internal Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
    2. 8.2 Typical Applications
      1. 8.2.1 DC-DC Converter Post Regulation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Design Considerations
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Capacitor-Free Operation from a Battery Input Supply
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Design Considerations
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C4B
  • Device Junction Temperature Range:
    –40°C to 150°C
  • Input Voltage Range: 1.4 V to 5.5 V
  • Stable Operation With or Without Capacitors
  • Foldback Overcurrent Protection
  • Package:
    • 2.0-mm × 2.0-mm WSON-6
    • 2.9-mm × 1.6-mm SOT-23
  • Very Low Dropout: 125 mV at 300 mA (3.3 VOUT)
  • Accuracy: 1% Typical, 1.4% Maximum
  • Low IQ: 34 µA
  • Available in Fixed-Output Voltages:
    1.0 V to 3.3 V
  • High PSRR: 50 dB at 1 kHz
  • Active Output Discharge