SBOS839J March   2017  – September 2019 TLV9061 , TLV9062 , TLV9064

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Single-Pole, Low-Pass Filter
      2.      Small-Signal Overshoot vs Load Capacitance
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions: TLV9061
    2.     Pin Functions: TLV9061S
    3.     Pin Functions: TLV9062
    4.     Pin Functions: TLV9062S
    5.     Pin Functions: TLV9064
    6.     Pin Functions: TLV9064S
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information: TLV9061
    5. 8.5  Thermal Information: TLV9061S
    6. 8.6  Thermal Information: TLV9062
    7. 8.7  Thermal Information: TLV9062S
    8. 8.8  Thermal Information: TLV9064
    9. 8.9  Thermal Information: TLV9064S
    10. 8.10 Electrical Characteristics
    11. 8.11 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Rail-to-Rail Input
      2. 9.3.2 Rail-to-Rail Output
      3. 9.3.3 EMI Rejection
      4. 9.3.4 Overload Recovery
      5. 9.3.5 Shutdown Function
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Low-Side Current Sense Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Input and ESD Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from I Revision (May 2019) to J Revision

  • Deleted TLV9062IDDFR (SOT-23 (8)) package preview notations throughout data sheetGo
  • Added industry standard package names to Device Comparison TableGo
  • Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–Go
  • Added link to Shutdown Function section in SHDN pin function rowsGo
  • Added EMI Rejection section to the Feature Description sectionGo
  • Changed Shutdown Function section to add more clarification Go

Changes from H Revision (April 2019) to I Revision

  • Added DDF (SOT-23) thermal information to replace TBDsGo

Changes from G Revision (December 2018) to H Revision

  • Added SOT-23 (8) information to Device InformationGo
  • Added DDF package column to Device Comparison TableGo
  • Added DDF (SOT-23) package to Pin FunctionsGo
  • Added DDF (SOT-23) package to Thermal InformationGo
  • Added TLV9062 RUG (X2QFN) thermal information to replace TBDsGo

Changes from F Revision (September 2018) to G Revision

  • Changed TLV9064 RUC package name From WQFN (14) : To X2QFN (14) in Device Information tableGo
  • Added TLV9064 RUC (X2QFN) pinout drawing to Pin Configuration and Functions sectionGo
  • Added RUC (X2QFN) package pinout information to Pin Functions: TLV9064 tableGo
  • Added RUC (X2QFN) to Thermal Information: TLV9064 tableGo

Changes from E Revision (July 2018) to F Revision

  • Deleted Shutdown part numbers from datasheet header Go
  • Deleted X2QFN (10) package from TLV9062 Device Information tableGo
  • Added references to shutdown part numbers in Description section Go
  • Changed TLV906xS series to TLV906xS family throughout datasheetGo
  • Added Shutdown devices to Device Comparison Table Go
  • Changed pin namings for all pinout drawings to reflect updated nomenclature Go
  • Added TLV9061S Thermal Information TableGo
  • Added TLV9064S Thermal Information TableGo
  • Deleted Partial Shutdown Amplifer Enable TimeGo
  • Added clarification on selecting resistors for a current sensing application in the Typical Applications Section Go
  • Changed wording of third bullet in Layout GuidelinesGo

Changes from D Revision (June 2018) to E Revision

  • Added TLV9061S device to Device Information tableGo
  • Added TLV9064S device to Device Information tableGo
  • Added RUC and RUG packages to the Device Comparison tableGo
  • Added TLV9061S DBV (SOT-23) pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9061S DBV (SOT-23) package pinout information to Pin Functions: TLV9061S tableGo
  • Added TLV9062S RUG (VSSOP) package pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9062S RUG (VSSOP) package pinout information to Pin Functions: TLV9062S tableGo
  • Added TLV9064 RTE (WQFN) pinout drawing to Pin Configuration and Functions section Go
  • Added TLV9064 RTE pinout information to Pin Functions: TLV9064 tableGo
  • Added TLV9064S RTE (WQFN) pinout drawing to Pin Configuration and Functions section Go

Changes from C Revision (March 2018) to D Revision

  • Added shutdown suffix to "TLV906x" to document titleGo
  • Added "Shutdown Version" bullet to Features list Go
  • Added TLV9062S device to Device Information tableGo
  • Added shutdown text to Description (continued) sectionGo
  • Added "(VS = [V+] – [V–]) supply voltage parameter in Absolute Maximum Ratings tableGo
  • Added "input voltage range" and "output voltage range" parameters and values to Recommended Operating Conditions tableGo
  • Added shutdown pin recommended operating conditions in Recommended Operating Conditions tableGo
  • Added "TA" symbol to "specified temperature" parameter to Recommended Operating Conditions table Go
  • Added Thermal Information: TLV9062S thermal table dataGo
  • Added Thermal Information: TLV9062S thermal table dataGo
  • Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8 V to 5.5 V tableGo
  • Added Shutdown Function section Go

Changes from B Revision (October 2017) to C Revision

  • Changed device status from Production Data/Mixed Status to Production Data Go
  • Deleted package preview note from TLV9061 DPW (X2SON) package in Device Information table Go
  • Deleted package preview note from TLV9061 DPW (X2SON) package pinout drawing Go
  • Changed formatting of ESD Ratings table to show different results for all packages Go
  • Deleted package preview note from DPW (X2SON) package in Thermal Information: TLV9061 table Go
  • Deleted package preview note from DPW (X2SON) package in Thermal Information: TLV9061 table Go

Changes from A Revision (June 2017) to B Revision

  • Added 8-pin PW package to Pin Configuration and Functions section Go
  • Added DSG (WSON) package to Thermal Information tableGo
  • Added PW (TSSOP) to TLV9062 Thermal Information table Go
  • Changed maximum input offset voltage value from ±1.6 mV to 2 mVGo
  • Changed maximum input offset voltage value from ±1.5 to ±1.6 mVGo
  • Changed minimum common-mode rejection ratio input voltage range from 86 dB to 80 dB Go
  • Changed typical input current noise density value from 10 to 23 fA/√HzGo
  • Changed THD + N test conditions from VS = 5 V to VS = 5.5 VGo
  • Added VCM = 2.5 V test condition to THD + N parameter in Electrical Characteristics table Go
  • Added maximum output voltage swing value from 25 mV to 60 mVGo
  • Changed maximum output voltage swing value from 15 mV to 20 mV Go

Changes from * Revision (March 2017) to A Revision

  • Changed device status from Advance Information to Production Data Go