SBOS545D February   2011  – December 2018 TMP103

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 One-Shot Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  Temperature Watchdog Function
      2. 7.5.2  Conversion Rate
      3. 7.5.3  Shutdown Mode (M1 = 0, M0 = 0)
      4. 7.5.4  One-Shot (M1 = 0, M0 = 1)
      5. 7.5.5  Continuous Conversion Mode (M1 = 1)
      6. 7.5.6  Bus Overview
      7. 7.5.7  Serial Interface
      8. 7.5.8  Serial Bus Address
      9. 7.5.9  Writing and Reading Operation
      10. 7.5.10 Slave Mode Operations
        1. 7.5.10.1 Slave Receiver Mode
        2. 7.5.10.2 Slave Transmitter Mode
      11. 7.5.11 General Call
      12. 7.5.12 High-Speed (Hs) Mode
      13. 7.5.13 Timeout Function
      14. 7.5.14 Multiple Device Access
        1. 7.5.14.1 Multiple Device Access Write
        2. 7.5.14.2 Multiple Device Access Read
      15. 7.5.15 NOISE
    6. 7.6 Register Maps
      1. 7.6.1 Pointer Register
      2. 7.6.2 Temperature Register
      3. 7.6.3 Configuration Register
      4. 7.6.4 Temperature Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at TA = 25°C and V+ = 1.4 V to 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Range –40 125 °C
Accuracy (temperature error) –10°C to 100°C, V+ = 1.8 V –2 0 2 °C
–40°C to 125°C, V+ = 1.8 V –3 ±1 3
vs supply –0.5 ±0.2 0.5 °C/V
Resolution 1 °C
DIGITAL INPUT/OUTPUT
VIH Input logic levels 0.7 (V+) V+ V
VIL –0.5 0.3 (V+)
IIN Input current 0 < VIN < (V+) + 0.3 V 1 μA
VOL SDA Output logic levels V+ > 2 V, IOL = 2 mA 0 0.4 V
V+ < 2 V, IOL = 2 mA 0 0.2 (V+)
Resolution 8 Bit
Conversion time 26 35 ms
Conversion modes CR1 = 0, CR0 = 0 (default) 0.25 Conv/s
CR1 = 0, CR0 = 1 1
CR1 = 1, CR0 = 0 4
CR1 = 1, CR0 = 1 8
Timeout time 30 40 ms
POWER SUPPLY
Operating supply range 1.4 3.6 V
IQ Quiescent current Serial bus inactive, CR1 = 0, CR0 = 0 (default), V+ = 1.8 V 1.5 3 μA
Serial bus active, SCL frequency = 400 kHz 15
Serial bus active, SCL frequency = 3.4 MHz 85
ISD Shutdown current Serial bus inactive, V+ = 1.8 V 0.5 1 μA
Serial bus active, SCL frequency = 400 kHz 10
Serial bus active, SCL frequency = 3.4 MHz 80
TEMPERATURE
Specified range –40 125 °C
Operating range –55 150 °C