SBOS335E June   2005  – December 2018 TMP300

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Pinout
      2.      Application Schematic
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings(1)

MIN MAX UNIT
V+ Supply voltage +18 V
Signal input pins, voltage(2) –0.5 (V+) + 0.5 V
Signal input pins, current(2) –10 10 mA
ISC Output short-circuit(3) Continuous
Open-drain output (V+) + 0.5 V
TA Functional temperature –40 +150 °C
Tstg Storage temperature –55 +150 °C
TJ Junction temperature +150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less.
Short-circuit to ground.