SBOS335E June   2005  – December 2018 TMP300

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Pinout
      2.      Application Schematic
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.