SBOS335E June   2005  – December 2018 TMP300

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Pinout
      2.      Application Schematic
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from D Revision (January 2016) to E Revision

  • Added Pin Configuration and Functions section Go

Changes from C Revision (January 2011) to D Revision

  • Added Device Information table, ESD Ratings table, Feature Description section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed Temperature Range Features bullet Go
  • Added package names to pinout Go
  • Deleted Ordering Information table Go
  • Changed Temperature Range, TA, Functional Range parameter name in Electrical Characteristics tableGo
  • Added footnote 4 to Electrical Characteristics table Go

Changes from B Revision (November 2008) to C Revision

  • Deleted second sentence from Description sectionGo
  • Added TMP300B grade device specifications to Electrical Characteristics tableGo